Organic light-emitting display device and the preparing method of the same

• US 20070232182A1
• Filed: 09/29/2006
• Published: 10/04/2007
• Est. Priority Date: 03/29/2006
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Park, Jin Woo
• Granted Patent: US 7,837,530 B2
• Time in Patent Office: Days
• US Class Current: 445/25
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8428 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8723 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 59/874 including getter material or desiccant

Abstract

An organic light-emitting display device includes a bottom substrate having a pixel region and a non-pixel region. In the pixel region, organic light-emitting pixels are formed. A top substrate is bonded to the top substrate. A sealing member is provided between the non-pixel region of the substrate and the encapsulation substrate. The sealing member includes a first frit and a second frit which melts substantially easier than the first frit upon irradiation of a laser or infrared beam thereto.

Claims

1. A method of making an organic light emitting display device, the method comprising:

providing a first substrate and a first frit bonded to the first substrate;

providing a second substrate and an array of organic light emitting pixels formed on the second substrate, the second substrate made of a single layer or multiple layers;

arranging the first substrate and the second substrate so as to oppose each other and interpose the array therebetween;

interposing a second frit between the first frit and the second substrate, the second frit forming a closed loop surrounding the array, the second frit is configured to melt substantially easier than the first frit upon irradiation of a laser or infrared beam thereto; and

bonding the second frit to the first frit and to the second substrate, thereby forming an integrated frit seal interposed between the first and second substrate wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located.

2. The method of claim 1, wherein interposing the second frit comprises placing the second frit on the first frit.

3. The method of claim 1, wherein bonding comprises melting and solidifying at least part of the second frit.

4. The method of claim 3, wherein melting comprises irradiating a laser or infrared beam to the second frit.

5. The method of claim 4, wherein the laser or infrared beam reaches the first frit, and wherein the first frit substantially melts substantially less than the second frit.

6. The method of claim 1, wherein each of the first and second frits comprises a light-to-heat conversion material configured to generate heat upon receiving the laser or infrared beam, and wherein the second frit comprises an amount of the light-to-heat conversion material substantially more than the first frit.

7. The method of claim 1, wherein the second frit comprises a light-to-heat conversion material configured to generate heat upon receiving the laser or infrared beam, and wherein the first frit is substantially free of light-to-heat conversion material.

8. The method of claim 1, wherein the first frit is substantially transparent.

9. The method of claim 1, wherein the second frit is substantially non-transparent.

10. The method of claim 1, wherein the first frit comprises a first end facing the second substrate, the second frit comprises a second end facing the first substrate, wherein the first end has a first width perpendicular to the shortest imaginary line interconnecting the first and second substrates in a plane perpendicular to an elongation of the frit seal, and wherein the second end has a second width in the same direction, wherein the first width is greater than the second width.

11. The method of claim 1, wherein the first frit comprises a first end facing the second substrate, the second frit comprises a second end facing the first substrate, wherein the first frit has a first height from the first substrate to the first end in a direction parallel to the shortest imaginary line interconnecting the first and second substrates in a plane perpendicular to an elongation of the frit seal, wherein the second frit has a second height from the second substrate to the second end in the same direction, wherein the first height is greater than the second height.

12. The method of claim 1, wherein providing the first substrate and the first frit comprises bonding the first frit to the first substrate.

13. The method of claim 12, wherein bonding comprises baking the first substrate and the first frit in contact with the first substrate, whereby at least part of the first frit melts and solidifies so as to bond to the first substrate.

14. The method of claim 1, wherein the array and the first substrate form a gap therebetween.

15. The method of claim 1, wherein the first frit has a volume substantially greater than that of the second frit.

16. The method of claim 1, further comprising forming a structure extending along at least part of the frit seal, wherein the structure is interposed between and interconnects the first and second substrates, and wherein the structure is located outside or inside the enclosed space.

17. The method of claim 16, wherein forming the structure comprises:

interposing a curable material between the first and second substrates; and

curing the curable material thereby forming the structure interconnecting the first and second structures.

18. The method of claim 1, further comprising forming a first structure and a second structure, each of which is interposed between and interconnects the first and second substrates, wherein the first structure extends along the frit seal inside the enclosed space, and wherein the second structure extends along the frit seal outside the enclosed space.

19. The method of claim 1, further comprising forming a structure extending along the frit seal and located inside or outside the enclosed space, wherein the structure comprises a portion interposed between and interconnects the first frit and the second substrate.

20. The method of claim 19, wherein the structure comprises another portion that is not interposed between the first frit of the frit seal and the first substrates.

21. The method of claim 19, wherein forming the structure comprises:

interposing a curable material between the first frit and the second substrate; and

curing the curable material thereby forming the structure interconnecting the first frit and the second structure.

22. The method of claim 1, further comprising forming a first structure and a second structure, each of which extends along the frit seal inside or outside the enclosed space, wherein the first structure is interposed between and interconnects the first and second substrates, wherein the second structure is interposed between and interconnects the first frit and the second substrate.

23. The method of claim 1, wherein each of the first and second frits comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li₂O), sodium oxide (Na₂O), potassium oxide (K₂O), boron oxide (B₂O₃), vanadium oxide (V₂O₅), zinc oxide (ZnO), tellurium oxide (TeO₂), aluminum oxide (Al₂O₃), silicon dioxide (SiO₂), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P₂O₅), ruthenium oxide (Ru₂O), rubidium oxide (Rb₂O), rhodium oxide (Rh₂O), ferrite oxide (Fe₂O₃), copper oxide (CuO), titanium oxide (TiO₂), tungsten oxide (WO₃), bismuth oxide (Bi₂O₃), antimony oxide (Sb₂O₃), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.