Method for conditioning a process chamber
First Claim
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1. A method of operating a semiconductor processing system comprising:
- determining a first chamber state for a processing chamber, wherein the first chamber state occurs after a first amount of chamber processing time;
taking a processing chamber off-line when the first chamber state indicates a first chamber maintenance procedure is required, wherein the first chamber maintenance procedure comprises a wet cleaning operation in which the processing chamber is not opened and is taken out of production for a first amount of time;
determining a second chamber state for the processing chamber;
performing a first chamber plasma conditioning procedure, wherein the first chamber conditioning procedure comprises a coating operation in which the chamber is not opened and is taken out of production for a second amount of time; and
putting the processing chamber back on-line.
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Abstract
A method of conditioning a processing chamber for a production process includes performing a conditioning step at a conditioning process recipe substantially different than a process recipe of the production process, and performing a warm-up process at a warm-up process recipe substantially the same as the process recipe of the production process. The method can be performed after a wet-cleaning process has been performed. The conditioning procedure can allow the maintenance time to be decreased and can cause the etched features to be more accurate.
208 Citations
22 Claims
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1. A method of operating a semiconductor processing system comprising:
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determining a first chamber state for a processing chamber, wherein the first chamber state occurs after a first amount of chamber processing time;
taking a processing chamber off-line when the first chamber state indicates a first chamber maintenance procedure is required, wherein the first chamber maintenance procedure comprises a wet cleaning operation in which the processing chamber is not opened and is taken out of production for a first amount of time;
determining a second chamber state for the processing chamber;
performing a first chamber plasma conditioning procedure, wherein the first chamber conditioning procedure comprises a coating operation in which the chamber is not opened and is taken out of production for a second amount of time; and
putting the processing chamber back on-line. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of conditioning a processing chamber for a production process, the method comprising:
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performing a conditioning step at a conditioning process recipe substantially different than a process recipe of the production process; and
performing a warm-up process at a warm-up process recipe substantially the same as the process recipe of the production process. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification