PACKAGING A MEMS DEVICE USING A FRAME
First Claim
Patent Images
1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:
- providing a transparent substrate comprising at least one MEMS device formed thereon;
providing a backplate;
providing a plurality of seal pieces configured to circumscribe the MEMS device; and
forming a MEMS package wherein the transparent substrate is joined to the plurality of seal pieces, and the seal pieces are joined to the backplate.
3 Assignments
0 Petitions
Accused Products
Abstract
A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.
110 Citations
30 Claims
-
1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:
-
providing a transparent substrate comprising at least one MEMS device formed thereon;
providing a backplate;
providing a plurality of seal pieces configured to circumscribe the MEMS device; and
forming a MEMS package wherein the transparent substrate is joined to the plurality of seal pieces, and the seal pieces are joined to the backplate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 30)
-
-
10. A microelectromechanical systems (MEMS) based device, comprising:
-
a transparent substrate comprising at least one MEMS device formed thereon;
a frame circumscribing the MEMS device and joined to said substrate; and
a backplate sealed to the frame and forming a MEMS device package. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A microelectromechanical (MEMS) device, comprising:
-
means for supporting a MEMS, having a MEMS device formed thereon;
means for sealing a MEMS package; and
means for spacing the sealing means apart from the supporting means, wherein said spacing means substantially circumscribes the MEMS device. - View Dependent Claims (26, 27, 28, 29)
-
Specification