Ultrasonic probe
First Claim
Patent Images
1. An ultrasonic probe, comprising:
- a plurality of ultrasonic oscillating elements arranged in a two-dimensional array;
a plurality of connection leads connected to the plurality of ultrasonic oscillating elements; and
a first board to connect the plurality of ultrasonic oscillating elements with at least one integrated circuit, wherein the first board includes, a first part having through-holes, which are electrically connected to the connection leads when the connection leads are inserted into the through-holes, and at least one second part, a part of which is formed to be bendable, that connects the first part and the at least one integrated circuit.
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Accused Products
Abstract
An ultrasonic probe includes ultrasonic oscillating elements arranged in a two-dimensional array shape, connection leads connected to the ultrasonic oscillating elements, and at least one board to connect the ultrasonic oscillating elements and integrated circuits. The board includes a first part having through-holes which are electrically connected to the connection leads when the connection leads are inserted, and second parts having bendable portions configured to connect the first part and the integrated circuits.
16 Citations
18 Claims
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1. An ultrasonic probe, comprising:
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a plurality of ultrasonic oscillating elements arranged in a two-dimensional array;
a plurality of connection leads connected to the plurality of ultrasonic oscillating elements; and
a first board to connect the plurality of ultrasonic oscillating elements with at least one integrated circuit, wherein the first board includes, a first part having through-holes, which are electrically connected to the connection leads when the connection leads are inserted into the through-holes, and at least one second part, a part of which is formed to be bendable, that connects the first part and the at least one integrated circuit. - View Dependent Claims (2, 3, 4)
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5. An ultrasonic probe, comprising:
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a plurality of ultrasonic oscillating elements arranged in a two-dimensional array shape;
a relay section having a plurality of second connection leads connected to the plurality of ultrasonic oscillating elements; and
a first board to connect the relay section and at least one integrated circuit, wherein the first board includes, a first part having through-holes, which are electrically connected to the plurality of second connection leads when the plurality of second connection leads are inserted into the through-holes, and at least one second part having a bendable portion configured to connect the first part and the at least one integrated circuit. - View Dependent Claims (6, 7, 8)
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9. An ultrasonic probe, comprising:
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a plurality of ultrasonic oscillating elements arranged in a two-dimensional array;
a plurality of connection leads connected to the ultrasonic oscillating elements; and
a plurality of first boards that connect the plurality of ultrasonic oscillating elements and at least one integrated circuit, each first board including a first part having through-holes to insert the plurality of connection leads and at least one second part that connects the first part and the at least one integrated circuit and has bendable portions, wherein the plurality of connection leads have portions electrically connected to the through-holes into which the plurality of connection leads are inserted. - View Dependent Claims (10, 11, 12, 13)
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14. An ultrasonic probe, comprising:
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a plurality of ultrasonic oscillating elements arranged in a two-dimensional array shape;
a relay section having a plurality of second connection leads connected to the plurality of ultrasonic oscillating elements;
a plurality of first boards that connect the relay section and at least one integrated circuit, each first board including a first part having through-holes to insert the plurality of second connection leads and at least one second part that connects the first part and the at least one integrated circuit and has a bendable portion; and
the plurality of second connection leads being electrically connected to the through-holes into which the plurality of second connection leads are inserted. - View Dependent Claims (15, 16, 17, 18)
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Specification