RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same

• US 20070273515A1
• Filed: 10/03/2005
• Published: 11/29/2007
• Est. Priority Date: 10/08/2004
• Status: Active Grant

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Thin Film Electronics ASA
• Inventors: Pavate, Vikram, MacKenzie, J.
• Granted Patent: US 9,953,259 B2
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes an interposer, an antenna and/or inductor on the interposer, and integrated circuitry on the interposer in a location other than the antenna and/or inductor. The integrated circuitry generally has a lowest layer in physical contact with the interposer surface. The method of manufacture generally includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use generally includes causing and/or inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal. The present invention advantageously provides a low cost RFID tag capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional RFID tags that manufacture all active electrical devices on a conventional wafer.

Claims

1. An identification device, comprising:

a) an interposer;

b) an antenna and/or inductor on said interposer; and

c) integrated circuitry on said interposer in a location other than the antenna and/or inductor, said integrated circuitry having a lowest layer in physical contact with a surface of said interposer.

2. The device of claim 1, wherein said integrated circuitry comprises at least one printed layer.

3. The device of claim 2, wherein said at least one printed layer comprises a semiconductor layer.

4. The device of claim 2, wherein said integrated circuitry further comprises a gate metal layer.

5. The device of claim 4, wherein said integrated circuitry further comprises a gate insulator layer between said gate metal layer and said semiconductor layer.

6. The device of claim 3, wherein said integrated circuitry further comprises source and drain terminals.

7. The device of claim 6, wherein said semiconductor layer comprises said source and drain terminals.

8. The device of claim 6, wherein said integrated circuitry further comprises a plurality of metal conductors in electrical communication with said gate metal layer and said source and drain terminals.

9. The device of claim 8, wherein said integrated circuitry further comprises an interlayer dielectric between said metal conductors and said semiconductor layer.

10. The device of claim 2, wherein said at least one printed layer comprises a gate metal layer.

11. The device of claim 2, wherein said at least one printed layer comprises an interlayer dielectric layer.

12. The device of claim 2, wherein said at least one printed layer comprises an interconnect metal layer.

13. The device of claim 1, wherein said interposer comprises a polyimide, a glass/polymer laminate, a high temperature polymer, or a metal foil.

14. The device of claim 13, wherein said interposer comprises said metal foil, with a dielectric film thereon.

15. The device of claim 1, wherein said antenna and/or inductor comprises said antenna, and said antenna comprises a metal.

32. A method of reading an identification device, comprising the steps of:

a) causing or inducing a current in the device of claim 1 sufficient for the device to radiate, reflect or modulate a detectable electromagnetic signal; and

b) detecting said detectable electromagnetic signal.

33. The method of claim 32, further comprising processing information conveyed by said detectable electromagnetic signal.

34. The method of claim 32, further comprising attaching or affixing the device to or including the device in an item.

16. A method for making an identification device, comprising the steps of:

a) forming a lowest layer of integrated circuitry on a surface of an interposer;

b) forming successive layers of said integrated circuitry on said lowest layer of integrated circuitry; and

c) attaching an electrically conductive functional layer to said interposer.

17. The method of claim 16, wherein said step of forming said lowest layer of integrated circuitry comprises depositing a vapor precursor of said lowest layer on said interposer.

18. The method of claim 16, wherein said step of forming said lowest layer of integrated circuitry comprises printing said lowest layer of integrated circuitry.

19. The method of claim 16, wherein said step of forming said successive layers of said integrated circuitry comprises printing at least one of said successive layers.

20. The method of claim 19, wherein said at least one of said successive layers comprises a semiconductor layer.

21. The method of claim 16, wherein at least one of said lowest layer and said successive layers of said integrated circuitry comprises a gate metal layer.

22. The method of claim 16, wherein one of said successive layers of said integrated circuitry comprises a gate dielectric layer.

23. The method of claim 16, wherein at least one of said lowest layer and said successive layers of said integrated circuitry comprises a transistor channel layer.

24. The method of claim 16, wherein at least one of said successive layers of said integrated circuitry comprises a source/drain layer.

25. The method of claim 16, wherein at least one of said successive layers of said integrated circuitry comprises an interconnect/metallization layer.

26. The method of claim 16, wherein forming said lowest layer of integrated circuitry comprises one of printing or conventional display processing said lowest layer, and forming said successive layers of said integrated circuitry comprises the other of printing or conventional display processing at least one of said successive layers.

27. A method for making an identification device, comprising the steps of:

a) forming a lowest layer of integrated circuitry on an interposer surface;

b) forming successive layers of said integrated circuitry on the lowest layer; and

c) forming an electrically conductive structure from a functional layer attached to the interposer.

28. The method of claim 27, wherein said interposer comprises a dielectric.

29. The method of claim 27, wherein said electrically conductive functional layer comprises a metal foil.

30. The method of claim 29, further comprising etching said metal foil to form an antenna and/or inductor.

31. The method of claim 27, wherein forming said lowest layer of integrated circuitry comprises one of printing or conventional display processing said lowest layer, and forming said successive layers of said integrated circuitry comprises the other of printing or conventional display processing at least one of said successive layers.