Health Data Collecting System and Semconductor Device

• US 20070285225A1
• Filed: 08/31/2005
• Published: 12/13/2007
• Est. Priority Date: 09/03/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Koyama, Jun, Yamazaki, Shunpei
• Granted Patent: US 7,768,391 B2
• Time in Patent Office: Days
• US Class Current: 340/539.120
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/02 Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
• CPC Class Codes: G06K 19/0716 at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/273 Adaptation for carrying or wearing by persons or animals
• CPC Class Codes: H01Q 1/362 for broadside radiating helical antennas

Abstract

Conventionally, people have to go to the place where a measurement instrument for health data is, to obtain health data and the like. Further, even when using a portable measurement instrument, people have to manage data by themselves, thus health data cannot be managed rapidly. According to the invention, a modulating circuit, a demodulating circuit, a logic circuit, a sensor circuit, and an antenna circuit are provided over an insulating substrate, thereby data sensed by the sensor circuit is transmitted wirelessly. According to the invention, health data on the living body (for example a human body) is sensed and can be rapidly detected.

Claims

1. A health data collecting system comprising:

a wireless chip including at least a sensor for obtaining biological information data, an antenna circuit for transmitting the biological information data, a modulating circuit, and a logic circuit;

an interrogator transmitting electromagnetic waves to the wireless chip; and

a data system evaluating the biological information data from the wireless chip,

wherein the wireless chip is attached to or buried in a living thing,

wherein the sensor and an antenna circuit are formed over an flexible substrate,

wherein a signal inputted from the antenna is modulated by the modulating circuit and inputted as data to the logic circuit.

2. The health data collecting system according to claim 1, further comprising a memory circuit for storing the biological information data over the flexible substrate,

wherein the sensor circuit is operationally connected to the logic circuit through the memory circuit;

wherein the logic circuit is operationally connected to the modulating circuit.

3. The health data collecting system according to claim 1, wherein the wireless chip includes at least a thin film transistor.

4. The health data collecting system according to claim 1, wherein the living thing is human.

5. A semiconductor device comprising:

a modulating circuit, a logic circuit, a sensor circuit, and an antenna circuit over an insulating substrate,

wherein the sensor circuit is operationally connected to the modulating circuit through the logic circuit; and

wherein the modulating circuit is operationally connected to the antenna circuit.

6. The semiconductor device according to claim 5, wherein the sensor circuit is a pressure circuit.

7. The semiconductor device according to claim 5, wherein the sensor circuit is an audio sensor.

8. The semiconductor device according to claim 5, wherein the sensor circuit is an optical sensor.

9. The semiconductor device according to claim 5, wherein the sensor circuit is an odor sensor.

10. The semiconductor device according to claim 5, wherein the antenna circuit, the modulating circuit, the logic circuit, and the sensor circuit are formed over the same insulating substrate.

11. The semiconductor device according to claim 5,

wherein the modulating circuit, the logic circuit, and the sensor circuit are integrated over the same insulating substrate;

and

wherein the antenna circuit is provided over another insulating substrate.

12. The semiconductor device according to claim 5,

wherein the modulating circuit and the logic circuit are integrated over the same insulating substrate;

and

wherein the sensor circuit is provided over anther insulating substrate.

13. The semiconductor device according to claim 5, wherein the insulating substrate is a glass substrate.

14. The semiconductor device according to claim 5, wherein the insulating substrate is a plastic substrate.

15. The semiconductor device according to claim 5, wherein the insulating substrate is an insulator in a film.

16. The semiconductor device according to claim 5, wherein the antenna circuit is provided over at least one of the modulating circuit and the logic circuit.

17. The semiconductor device according to claim 5, wherein a signal inputted to the antenna circuit is a wireless signal.

18. A semiconductor device comprising:

a modulating circuit, a logic circuit, a sensor circuit, an antenna circuit, and a memory circuit over an insulating substrate,

wherein the sensor circuit is operationally connected to the logic circuit through the memory circuit;

wherein the logic circuit is operationally connected to the modulating circuit; and

wherein the modulating circuit is operationally connected to the antenna circuit.

19. The semiconductor device according to claim 18, wherein the sensor circuit is a pressure circuit.

20. The semiconductor device according to claim 18, wherein the sensor circuit is an audio sensor.

21. The semiconductor device according to claim 18, wherein the sensor circuit is an optical sensor.

22. The semiconductor device according to claim 18, wherein the sensor circuit is an odor sensor.

23. The semiconductor device according to claim 18, wherein the antenna circuit, the modulating circuit, the logic circuit, and the sensor circuit are formed over the same insulating substrate.

24. The semiconductor device according to claim 18,

wherein the modulating circuit, the logic circuit, and the sensor circuit are integrated over the same insulating substrate;

and

wherein the antenna circuit is provided over another insulating substrate.

25. The semiconductor device according to claim 18,

wherein the modulating circuit and the logic circuit are integrated over the same insulating substrate;

and

wherein the sensor circuit is provided over anther insulating substrate.

26. The semiconductor device according to claim 18, wherein the antenna circuit is provided over at least one of the modulating circuit and the logic circuit.