Micro universal serial bus memory package and manufacturing method the same

• US 20070295982A1
• Filed: 10/13/2006
• Published: 12/27/2007
• Est. Priority Date: 06/27/2006
• Status: Active Grant

• Current Assignee: Hana Micron Incorporated
• Original Assignee: Hana Micron Incorporated
• Inventors: Ryu, Ki Tae, Cho, Nam Young, Kwon, Yong An, Lee, Hee Bong
• Granted Patent: US 7,709,946 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: G06K 19/07732 the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks housings for electrical equipment in general, see H05K5/02
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/48479 : on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48499 : Material of the auxiliary connecting means
• CPC Class Codes: H01L 2224/48639 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48644 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48647 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48655 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48664 : Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48739 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48744 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48747 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48755 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48764 : Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48839 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48844 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48847 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48855 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48864 : Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/49113 : the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83101 : as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/85 : using a wire connector
• CPC Class Codes: H01L 2224/85013 : Plasma cleaning
• CPC Class Codes: H01L 2224/85051 : Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
• CPC Class Codes: H01L 2224/85186 : connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
• CPC Class Codes: H01L 2224/85439 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/85444 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/85447 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/85455 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/85464 : Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/85986 : Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/075 : the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

The present invention relates to a micro USB memory package and a method for manufacturing the same. The object of the present invention is to provide a micro USB memory package and a method for manufacturing the same, which can meet the USB standard specification, can have light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof.

In order to accomplish the object of the present invention, there is disclosed a micro USB memory package, which comprises a substrate with a plurality of circuit patterns formed on the top surface thereof, at least one of passive elements connected with the circuit patterns of the substrate, at least one of controllers connected with the circuit patterns of the substrate, at least one of flash memories connected with the circuit patterns of the substrate, and an encapsulation part encapsulating the passive elements, the controllers and the flash memories on the substrate, and at least one of USB lands connected with the circuit patterns by a conducting via are formed on the under surface of one side of the substrate.

Claims

1. A micro USB memory package comprising:

a substrate with a plurality of circuit patterns formed on the top surface thereof;

at least one of passive elements connected with the circuit patterns of the substrate;

at least one of controllers connected with the circuit patterns of the substrate;

at least one of flash memories connected with the circuit patterns of the substrate; and

an encapsulation part encapsulating the passive elements, the controllers and the flash memories on the substrate;

wherein at least one of USB lands connected with the circuit patterns by a conducting via is formed on the under surface of one side of the substrate.

2. The micro USB memory package as claimed in claim 1, wherein at least one of the passive elements, the controllers or the flash memories is connected with the circuit patterns on the top surface corresponding to the USB lands of the substrate.

3. The micro USB memory package as claimed in claim 1, wherein an LED element is further connected with the circuit patterns of the substrate.

4. The micro USB memory package as claimed in claim 3, wherein the encapsulation part is formed of transparent material so as to see the LED element from the outside.

5. The micro USB memory package as claimed in claim 1, wherein at least one of further USB lands are additionally formed on the under surface of the other side corresponding to the USB lands formed on the under surface of one side of the substrate.

6. The micro USB memory package as claimed in claim 5, wherein the USB lands formed on one side and the USB lands formed on the other side are arranged in reverse order with respect to each other, and both USB lands are interconnected by the circuit patterns and the conducting via.

7. The micro USB memory package as claimed in claim 1, wherein the controllers are attached to the substrate by an adhesive and are connected with the circuit patterns of the top surface of the substrate by a wire.

8. The micro USB memory package as claimed in claim 1, wherein the flash memories are attached to the substrate by an adhesive and are connected with the circuit patterns of the top surface of the substrate by a wire.

9. The micro USB memory package as claimed in claim 8, wherein at least two of the flash memories are stacked by the adhesive.

10. The micro USB memory package as claimed in claim 8, wherein the wire connecting the flash memories with the circuit patterns is formed by a forward loop mode process or a forward folded loop mode process in which one end of the wire is firstly ball-bonded to the flash memories and the other end of the wire is secondly stitch-bonded to the circuit patterns.

11. The micro USB memory package as claimed in claim 8, wherein the wire connecting the flash memories with the circuit patterns is formed by a reverse loop mode process in which one end of the wire is firstly ball-bonded to the circuit patterns and the other end of the wire is secondly stitch-bonded to a conducting bump (stud bump) preformed on the flash memories.

12. The micro USB memory package as claimed in claim 1, wherein the substrate and the encapsulation part are coupled with an external case.

13. The micro USB memory package as claimed in claim 12, wherein the external case comprises:

an upper section covering the encapsulation part;

a lower section covering the substrate;

a side section covering the both side surfaces of the substrate and the encapsulation part; and

a rear section covering the rear surfaces of the substrate and the encapsulation part.

14. The micro USB memory package as claimed in claim 12, wherein the USB lands formed on the substrate are exposed to the outside by the external case.

15. A method for manufacturing a micro USB memory package comprising the steps of:

providing a substrate with at least one of circuit patterns formed on the top surface thereof and connecting at least one of passive elements with the circuit patterns of the substrate;

attaching at least one of controllers and flash memories to the top surface of the substrate;

connecting the controllers and the flash memories with the circuit patterns of the substrate by a wire; and

forming an encapsulation part by encapsulating the passive elements, the controllers, the flash memories and the wire on the substrate by an encapsulant.

16. The method for manufacturing the micro USB memory package as claimed in claim 15, wherein at least one of USB lands connected with the circuit patterns by a conducting via are further formed on the under surface of one side of the substrate.

17. The method for manufacturing the micro USB memory package as claimed in claim 16, wherein at least one of the passive elements, the controllers or the flash memories are connected with the circuit patterns on the top surface corresponding to the USB lands of the substrate.

18. The method for manufacturing the micro USB memory package as claimed in claim 15, wherein the wire connecting the flash memories with the circuit patterns is formed by a forward loop mode process or a forward folded loop mode process in which one end of the wire is firstly ball-bonded to the flash memories and the other end of the wire is secondly stitch-bonded to the circuit patterns.

19. The method for manufacturing the micro USB memory package as claimed in claim 15, wherein the wire connecting the flash memories with the circuit patterns is formed by a reverse loop mode process in which one end of the wire is firstly ball-bonded to the circuit patterns and the other end of the wire is secondly stitch-bonded to a conducting bump preformed on the flash memories.

20. The method for manufacturing the micro USB memory package as claimed in claim 15, wherein at least two of the flash memories are stacked by an adhesive.