THREE DIMENSIONAL INTEGRATED CIRCUIT AND METHOD OF MAKING THE SAME

  • US 20070296073A1
  • Filed: 06/27/2006
  • Published: 12/27/2007
  • Est. Priority Date: 06/27/2006
  • Status: Active Grant
First Claim
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1. A three dimensional integrated circuit structure, comprising:

  • at least first and second devices, each device comprising a substrate and a device layer formed over said substrate, said first and second devices being bonded together in a stack,wherein the bond between the first and second devices comprises a metal-to-metal bond and a non-metal-to-non-metal bond.

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