MODULAR LIQUID COOLING OF ELECTRONIC COMPONENTS WHILE PRESERVING DATA CENTER INTEGRITY

• US 20070297136A1
• Filed: 06/23/2006
• Published: 12/27/2007
• Est. Priority Date: 06/23/2006
• Status: Abandoned Application

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Konshak, Michael V.
• Application Number:
  US11/426,238
• Publication Number:
  US 20070297136A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 2013/005 Thermal joints
• CPC Class Codes: F28F 2275/14 by using form fitting connection, e.g. with tongue and groove
• CPC Class Codes: F28F 3/048 in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20781 within cabinets for removing heat from server blades

Abstract

The integrity of the data center cooling system is maintained by using separate and independent cooling loops to collect heat from electronic components housed in modular units. According to one embodiment of the present invention, a first cooling loop is associated with each modular unit. The first cooling loop comprises a coolant that accepts heat from electronic components housed within the modular unit and transports the heat to a heat exchanging system. The heat exchanging system conducts heat from the coolant of the first loop to coolant associated with the data center cooling system. Coolant from the data center cooling system accepts heat from the coolant associated with the first loop and conveys it away from the data center.

Claims

1. A system for modular cooling of electronic components while preserving the integrity of a data center cooling structure, the system comprising:

a modular unit configured to house within the modular unit a plurality of electronic components wherein the modular unit is mountable in a rack via a thermally conductive element;

a first liquid cooling loop configured to be in thermal contact with the plurality of electronic components within the modular unit and in thermal communication with a first portion of the thermally conductive element; and

a second liquid cooling loop in thermal communication with a second portion of the thermally conductive element wherein upon mounting the modular unit in the rack the first portion of the thermally conductive element is in physical and thermal contact with the second portion of the conductive element.

2. The system of claim 1, wherein the rack is an integrated portion of the second cooling loop.

3. The system of claim 1, wherein the rack is configured to house a plurality of modular units.

4. The system of claim 1, wherein the first liquid cooling loop is entirely contained within the modular unit.

5. The system of claim 1, wherein the first liquid cooling loop is entirely contained within the rack separate from the second liquid cooling loop.

6. The system of claim 1, wherein the first portion of the thermally conductive element comprises two or more surfaces extending from the modular unit, and wherein the second portion of the thermally conductive element comprises two or more surfaces configured to receive the two or more surfaces of the first portion of the thermally conductive element.

7. The system of claim 6, wherein the thermally conductive element comprises a lever configured to drive together the two or more surfaces of the first portion of the conductive element and the two or more surfaces of the second portion of the conductive element so as to increase thermal contact between the two or more surfaces of the first portion of the conductive element and the two or more surfaces of the second portion of the conductive element.

8. The system of claim 1, wherein each portion of the thermally conductive elements are co-joined with a thermally conductive interface to minimize voids when joined.

9. The system of claim 1, wherein the first portion of the thermally conductive element comprises a first channel capable of receiving cooling liquid from the first cooling loop and a second channel capable of returning cooling liquid to the first cooling loop.

10. The system of claim 1, wherein the second portion of the thermally conductive element comprises a first channel capable of receiving cooling liquid from the second cooling loop and a second channel capable of returning cooling liquid to the second cooling loop.

11. A cooling system for modular electronic components, the system comprising:

at least one modular unit mountable into a rack wherein the at least one modular unit is configured to house within the at least one modular unit a plurality of electronic components;

a first cooling loop configured to be in thermal contact with the plurality of electronic components within each at least one modular unit and in thermal communication with a heat exchanger; and

a second cooling loop configured to be thermal communication with the heat exchanger wherein heat from the plurality of electronic component is transferred to the first cooling loop, and wherein heat from the first cooling loop is transferred to the second cooling loop via the heat exchanger.

12. The system of claim 11, wherein the first cooling loop comprises a first liquid contained in a first conduit configured to flow between each modular unit and the heat exchanger.

13. The system of claim 11, wherein the second cooling loop comprises a second liquid contained in a second conduit configured to flow between the heat exchanger and an evaporator configured to extract heat from the second liquid.

14. The system of claim 11, wherein the cooling loop comprises a modular conduit portion wholly contained within each at least one modular unit and a rack loop portion, and wherein each modular portion is in fluid communication with the rack portion.

15. The system of claim 14, wherein upon removal of any modular portion of the cooling loop, the rack portion of the cooling loop and remaining modular portions remain functional.

16. A method for removing heat from one or more modular units mounted in a rack, wherein each modular unit houses a plurality of electronic components, the method comprising:

transferring heat generated from the plurality of electronic components to a first liquid contained within a first cooling loop, wherein the first cooling loop is in thermal contact with the plurality of electronic components, and the first cooling loop and the plurality of electronic components are wholly within the one or more modular units;

flowing the first liquid through at least one channel of a first portion of at least one conductive element transferring heat from the first liquid to the first portion of the at least one conductive element, wherein the first portion of the conductive element is affixed to a longitudinal length of the one or more modular units, and wherein the first portion of the at least one conductive element comprises at least two surfaces extending laterally from the longitudinal length;

coupling the first portion of the at least one conductive element to a second portion of the at least one conductive element, wherein the second portion of the at least one conductive element is affixed to the rack, and wherein the second portion of the at least one conductive element comprises at least two surfaces extending laterally from the from the rack toward the first portion of the at least one conductive element so as to interlock with surfaces extending laterally from the longitudinal length of the one or more modular units; and

wherein heat from the first portion of the at least one conductive element flows to the second portion of the at least one conductive element; and

flowing a second liquid contained within a second cooling loop through at least one channel of the second portion of the at least one conductive element, wherein the second liquid accepts heat from the second portion of the at least one conductive element, and wherein the second cooling loop conveys heat away from the rack.

17. The method of claim 16, wherein the second cooling loop is thermally coupled to a plurality of racks.

18. The method of claim 16, further comprising pressing the surfaces of the first portion together with surfaces of the second portion of the at least one conductive element so as to increase surface contact.

19. The method of claim 16, wherein the first liquid and the second liquid are maintained in separate loops and have separate fluid reservoirs.

20. The method of claim 16, wherein integrity of the second cooling loop is maintained when one or more modular units are removed or replaced.