Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
First Claim
1. A positioning method, comprising:
- a pre-measurement process in which before an object that has at least two marks formed on a surface to be measured thereof is loaded into a processing apparatus that performs predetermined processing to the object, at least a part of an outer edge of a surface to be measured of the object and each of the marks are detected, and a position coordinate of each of the marks in an outer shape reference coordinate system that is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by at least one datum point on the outer edge is measured based on the detection results;
a main measurement process in which at least a part of the outer edge of the surface to be measured of the object is detected, and position information of the object in the outer shape reference coordinate system is measured based on the detection results, in order to perform positioning of the object on loading of the object into the processing apparatus; and
an adjustment process in which a relative positional relation in the two-dimensional coordinate system of the object to be loaded into the processing apparatus based on the measurement results of the main measurement process with respect to a measurement field of a mark measurement unit that is arranged within the processing apparatus and measures a position of each of the marks on the object is adjusted, based on measurement results in the pre-measurement process.
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Accused Products
Abstract
An edge of a surface to be measured of wafer and each of search alignment marks on the wafer are detected by an inline measurement instrument or the like that operates independently of an exposure apparatus, and position coordinates of the search marks in an X′Y′ coordinate system, which is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by a position of a notch of the wafer, are measured. Then, in pre-alignment performed when loading the wafer into the exposure apparatus, the edge of the wafer is detected, and from the detection results, position information of the object in the X′Y′ coordinate system is measured. Further, a relative position in the X′Y′ coordinate system of the wafer to be loaded into the exposure apparatus based on measurement results of the pre-alignment with respect to a measurement field of an alignment system that measures positions of the search marks on the wafer is adjusted based on measurement results of the inline measurement instrument or the like.
98 Citations
52 Claims
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1. A positioning method, comprising:
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a pre-measurement process in which before an object that has at least two marks formed on a surface to be measured thereof is loaded into a processing apparatus that performs predetermined processing to the object, at least a part of an outer edge of a surface to be measured of the object and each of the marks are detected, and a position coordinate of each of the marks in an outer shape reference coordinate system that is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by at least one datum point on the outer edge is measured based on the detection results;
a main measurement process in which at least a part of the outer edge of the surface to be measured of the object is detected, and position information of the object in the outer shape reference coordinate system is measured based on the detection results, in order to perform positioning of the object on loading of the object into the processing apparatus; and
an adjustment process in which a relative positional relation in the two-dimensional coordinate system of the object to be loaded into the processing apparatus based on the measurement results of the main measurement process with respect to a measurement field of a mark measurement unit that is arranged within the processing apparatus and measures a position of each of the marks on the object is adjusted, based on measurement results in the pre-measurement process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A processing system, comprising:
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a processing apparatus that performs predetermined processing to an object;
a mark measurement unit that performs position measurement of at least two marks formed on the object loaded into the processing apparatus;
a pre-measurement apparatus that, before the object that has at least two marks formed on a surface to be measured thereof is loaded into the processing apparatus, detects at least a part of an outer edge of the surface to be measured of the object and each of the marks, and measures a position coordinate of each of the marks in an outer shape reference coordinate system that is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by at least one datum point on the outer edge of the object, based on the detection results;
an outer edge measurement unit that detects at least a part of the outer edge of the surface to be measured of the object, and measures position information of the object in the outer shape reference coordinate system based on the detection results, in order to perform positioning of the object on loading of the object into the processing apparatus; and
an adjustment unit that adjusts a relative positional relation in the two-dimensional coordinate system of the object to be loaded into the processing apparatus based on the measurement results of the outer edge measurement unit with respect to a measurement field of the mark measurement unit, based on measurement results of the pre-measurement apparatus. - View Dependent Claims (26, 27, 28, 29, 30)
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31. A measurement method of substrate loading repeatability in which repeatability of a loading position of a substrate that is loaded to a datum position arranged within a substrate processing apparatus, the method comprising:
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a position setting process in which positions of a plurality of the substrates on which a device pattern is to be sequentially transferred are sequentially set to the datum position;
a measurement process in which position information of a mark that is formed on the substrate loaded to the datum position is sequentially measured by a measurement instrument arranged within the substrate processing apparatus; and
a computation process in which the loading repeatability is computed based on measurement results of the measurement process. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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39. A substrate processing apparatus that sequentially processes a plurality of substrates, the apparatus comprising:
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a position setting unit that sequentially sets positions of the substrates to a predetermined datum position;
a measurement unit that measures position information of a mark formed on the substrate whose position is set to the datum position; and
a computation unit that computes loading repeatability of the substrate based on measurement results of the measurement unit. - View Dependent Claims (40)
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41. A measurement method, comprising:
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a first process in which at least a part of an outer edge of a surface to be measured of an object that has a mark formed on the surface to be measured thereof is measured;
a second process in which the mark is measured; and
a third process in which position information of the mark in an outer shape reference coordinate system that is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by at least one datum point on the outer edge is obtained based on measurement results of the first and second processes. - View Dependent Claims (42, 43, 44)
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45. A measurement method, comprising:
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a first process in which at least a part of an outer edge of an object is measured before the object is loaded into a processing apparatus that performs predetermined processing to the object; and
a second process in which measurement results of the first process and/or evaluation results obtained by evaluating the measurement results of the first process in a predetermined evaluation method are/is sent to the processing apparatus. - View Dependent Claims (49, 50)
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46. A measurement apparatus, comprising:
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a first measurement sensor that measures at least a part of an outer edge of a surface to be measured of an object that has a mark formed on the surface to be measured thereof;
a second measurement sensor that measures the mark; and
a computation unit that obtains position information of the mark in an outer shape reference coordinate system that is a two-dimensional coordinate system substantially parallel to the surface to be measured and is set by at least one datum point on the outer edge, based on measurement results of the first and second sensors. - View Dependent Claims (47, 51, 52)
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48. A measurement apparatus, comprising:
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a sensor that is disposed outside a processing apparatus that performs predetermined processing to an object and measures at least a part of an outer edge of the object before the object is loaded into the processing apparatus; and
a transmission unit that sends measurement results of the sensor and/or evaluation results obtained by evaluating the measurement results of the sensor in a predetermined evaluation method to the processing apparatus.
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Specification