METHOD OF FORMING SEMICONDUCTOR CHIPS, THE SEMICONDUCTOR CHIPS SO FORMED AND CHIP-STACK PACKAGE HAVING THE SAME

  • US 20080014735A1
  • Filed: 07/09/2007
  • Published: 01/17/2008
  • Est. Priority Date: 07/07/2006
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor chip, the method comprising:

  • preparing a semiconductor substrate comprising a chip region and a scribe line region;

    forming a bonding pad on the chip region of the semiconductor substrate;

    forming a protective layer to cover a portion of the semiconductor substrate, the protective layer exposing a portion of the bonding pad and a portion of the scribe line region;

    forming a redistribution pattern overlying the protective layer, the redistribution pattern electrically coupled to the exposed portion of the bonding pad and covering the exposed scribe line region; and

    removing a portion of the semiconductor substrate located below the redistribution pattern in the scribe line region to form a semiconductor strut contacting the redistribution pattern.

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