Mechatronic integration of motor drive and E-machine, especially smart-E-motor

• US 20080018290A1
• Filed: 01/05/2007
• Published: 01/24/2008
• Est. Priority Date: 01/06/2006
• Status: Active Grant

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Hauenstein, Henning
• Granted Patent: US 7,567,053 B2
• Time in Patent Office: Days
• US Class Current: 318/722
• CPC Class Codes: H02K 11/33 Drive circuits, e.g. power electronics H02K11/38 takes precedence

Abstract

The power switches of an inverter are mechanically integrated with an electric motor of a vehicle and are mounted on the end plate of the motor and employ short connections between the motor a-c terminals and the inverter a-c output terminals. Bond wireless modules are employed. The electronic controls for the inverter are mounted on a main control board which is positioned remotely from the inverter and is not subject to the heat and EMI produced by the inverter.

Claims

1. A power control system for an a-c motor having input a-c terminals;

said power control system comprising an inverter circuit having a-c and d-c terminals and a control circuit for said inverter circuit;

said a-c motor having a heat sink fixed thereto;

said inverter circuit being mounted on said heat sink and having its a-c terminals connected to said input a-c terminals of said a-c motor by short power conductors;

said control circuit including a microcontroller for controlling said inverter circuit being mounted remotely from said inverter circuit and coupled thereto by a low power interface link.

2. The system of claim 1, wherein said inverter circuit comprises of a plurality of power semiconductor switching devices mounted in a bond wireless module.

3. The system of claim 2, wherein said plurality of switching devices are IGBTs.

4. The system of claim 1, wherein said inverter circuit is a three phase bridge connected circuit and said motor is a three phase motor.

5. The system of claim 2, wherein said inverter circuit is a three phase bridge connected circuit and said motor is a three phase motor.

6. The system of claim 3, wherein said inverter circuit is a three phase bridge connected circuit and said motor is a three phase motor.

7. The system of claim 4, wherein said inverter circuit comprises 3 half bridge circuits supported in separate modules.

8. The system of claim 7, wherein said plurality of switching devices are IGBTs.

9. The system of claim 1, wherein said control circuit further comprises I/O modules coupled to said microcontroller and a sensor module coupled between the output current of said inverter and said microcontroller.

10. The system of claim 9, wherein said inverter circuit consists of a plurality of power semiconductor switching devices mounted in a bond wireless module.

11. The system of claim 7, wherein said control circuit further comprises I/O modules coupled to said microcontroller and a sensor module coupled between the output current of said inverter and said microcontroller.

12. The system of claim 2, which further includes a fluid coolant circulated in said heatsink for cooling both said motor and said switching devices.

13. The system of claim 1, which further includes a d-c source connected to said d-c terminals of said inverter circuit and a d-c bus capacitor connected in parallel with said d-c source.

14. The system of claim 13, wherein said d-c bus capacitor is mounted on said heat sink.

15. The system of claim 14, wherein said inverter circuit is a three phase bridge connected circuit and said motor is a three phase motor.

16. The system of claim 14, which further includes a fluid coolant circulated in said heatsink for cooling both said motor and said switching devices.

17. The system of claim 16, wherein said inverter circuit consists of a plurality of power semiconductor switching devices mounted in a bond wireless module.

18. The system of claim 17, wherein said plurality of switching devices are IGBTs.