Stable Adhesives From Urea-Denatured Soy Flour
First Claim
Patent Images
1. A method for making a stable adhesive, the method comprising:
- heating soy flour until denatured and substantially free of urease; and
adding urea to the denatured soy flour, wherein a stable, soy flour-based adhesive is formed.
3 Assignments
0 Petitions
Accused Products
Abstract
The present invention provides an improved method of producing a stable urea-denatured soy flour-based adhesive having improved wet and dry strengths, with more efficient production and lower production costs. The method comprises heating soy flour until denatured and then adding urea to the denatured soy flour. The soy flour may be heated up to 40° C. to 100° C. for at least 15 to 500 minutes. Optionally, the method may also include adding a cross-linking agent to the soy flour/urea mixture and/or adding an emulsified or dispersed polymer. Adhesives prepared according to this invention offer increased stability and strength properties.
103 Citations
36 Claims
-
1. A method for making a stable adhesive, the method comprising:
-
heating soy flour until denatured and substantially free of urease; and adding urea to the denatured soy flour, wherein a stable, soy flour-based adhesive is formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
-
-
22. A method for making a stable soy/urea dispersion, the method comprising:
-
heating soy flour until denatured and substantially free of urease; adding urea to the denatured soy flour to form a soy flour-based adhesive; and adding a polymer to the soy flour-based adhesive, wherein a stable soy/urea dispersion is formed. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
-
Specification