Apparatus, system and method for use in mounting electronic elements

• US 20080041625A1
• Filed: 08/16/2006
• Published: 02/21/2008
• Est. Priority Date: 08/16/2006
• Status: Active Grant

• Current Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Original Assignee: Cotco Holdings Limited
• Inventors: Cheong, Cheng Siu, Hui, Xie Jian
• Granted Patent: US 8,367,945 B2
• Time in Patent Office: Days
• US Class Current: 174/521
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48097 the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a recess formed in the casing and extending into the casing, an insert secured with the casing and extending about the recess defining a portion of a surface of the recess with the insert comprising a reflective surface exposed along the recess, and a plurality of leads partially exposed through the recess.

Claims

1. A surface mount device comprising:

a casing comprising a recess formed in the casing and extending into the casing;

an insert secured with the casing and extending about the recess defining a portion of a surface of the recess, the insert comprising a reflective surface exposed along the recess; and

a plurality of leads partially exposed through the recess.

2. The surface mount device of claim 1, wherein the insert comprises a ring circumferentially extending about and defining the portion of the surface of the recess.

3. The surface mount device of claim 2, wherein the ring has a height that is less than the height of the recess.

4. The surface mount device of claim 2, wherein the casing is at least partially constructed of black polyphthalamide material.

5. The surface mount device of claim 2, wherein the insert has a first edge positioned proximate a surface of the casing, and a second edge distal from the surface of the casing, where the insert comprises four adjacent sections and tapers from the first edge to the second edge.

6. The surface mount device of claim 5, wherein each of the four sections are generally portions of circles each having a first radius proximate the second edge that is greater than a second radius proximate the first edge such that each section intersects two neighboring sections.

7. The surface mount device of claim 2, wherein the insert comprises tabs that generally extend away from the reflective surface and into the casing.

8. The surface mount device of claim 1, wherein the insert comprises a first edge positioned proximate an exterior surface of the casing, a second edge distal from the exterior surface of the casing, and a ledge proximate the first edge that extends away from the reflective surface and into the casing.

9. The surface mount device of claim 8, wherein the ledge further comprises tabs extending from the ledge into the casing.

10. The surface mount device of claim 2, further comprising an electronic device coupled with a first lead of the first plurality of leads, wherein the recess exposes at least a portion of the electronic device.

11. A surface mount device comprising:

a casing comprising a first surface and a recess formed in the casing extend from the first surface and into the casing;

a first plurality of leads extending from the recess through the casing and exiting the casing;

an electronic device coupled with at least one of the plurality of leads and at least partially exposed through the recess; and

an insert comprising a reflective surface, the insert extends about at least a portion of a surface of the recess and is secured with the casing with the reflective surface of the insert exposed through the recess.

12. The surface mount device of claim 11, wherein the insert is a ring extending entirely around a perimeter of the recess.

13. The surface mount device of claim 12, wherein the insert comprises a first edge proximate the first surface of the casing and a second edge distant from the first surface of the casing wherein the second edge comprises a plurality of adjoining segments.

14. The surface mount device of claim 13, wherein the plurality of segments comprise four curved segments with each of the four curved segments having a first radius proximate the second edge that is greater than a second radius proximate the first edge of the insert.

15. The surface mount device of claim 13, wherein the reflective surface of the insert is generally frustoconical shaped.

16. A method for use in manufacturing a surface mount device, the method comprising:

positioning a plurality of leads;

positioning a ring with a reflective surface proximate the plurality of leads;

securing the plurality of leads and the ring with a casing such that the ring is maintained at a predefined position relative to the leads with a reflective surface of the ring exposed through a recess of the casing; and

securing an electronic device with at least one of the plurality of leads.

17. The method of claim 16, wherein the positioning of the ring with the reflective surface proximate the plurality of leads comprises securing a support structure with the ring;

the securing the ring with the casing comprises forming the casing about the ring and the support structure; and

removing at least a portion of the support structure following the forming of the casing about the ring.

18. The method of claim 16, wherein the securing the ring comprises securing the ring with a first edge of the ring proximate a first surface of the casing and a second edge distant from the first surface of the casing with the ring having a generally circular shape at the first edge and tapering to four sections at the second edge.

19. The method of claim 16, wherein the securing the plurality of leads and the ring with the casing comprises securing the plurality of leads with the casing such the that at least a portion of the at least one of the plurality of leads is exposed through the recess;

and

the securing the electronic device with the at least one of the plurality of leads comprises securing the electronic device with the at least one of the plurality of leads such that at least a portion of the electronic device is exposed through the recess.