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Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips

  • US 20080044934A1
  • Filed: 08/21/2006
  • Published: 02/21/2008
  • Est. Priority Date: 08/21/2006
  • Status: Active Grant
First Claim
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1. A semiconductor light emitting device packaging method comprising:

  • fabricating a substrate configured to mount a semiconductor light emitting device thereon;

    mounting the semiconductor light emitting device on the substrate;

    electrically connecting the semiconductor light emitting device to a contact portion of the substrate; and

    liquid injection molding the substrate to form an optical element bonded to the substrate over the semiconductor light emitting device.

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