IMAGE SENSOR MODULE

• US 20080048097A1
• Filed: 09/19/2006
• Published: 02/28/2008
• Est. Priority Date: 08/28/2006
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Lee, Chia-Jung, Chen, Jian-Cheng, Cheng, Ming-Hsiang
• Granted Patent: US 7,446,295 B2
• Time in Patent Office: Days
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concave is located on a surface of the substrate. The image signal processor is disposed in the concave, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concave. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Claims

1. An image sensor module, comprising:

a substrate, having a concave on a surface;

an image signal processor, disposed in the concave of the substrate and electrically connected to the substrate;

a supporting board, disposed on the surface of the substrate and covering the concave;

an image sensor chip, disposed on the supporting board and electrically connected to the substrate; and

a cover, disposed on the substrate and covering the image sensor chip.

2. The image sensor module as claimed in claim 1, wherein the cover comprises:

an adapter, disposed on the substrate, and having an upper end and a lower end, wherein the upper end has an accommodating space, and the lower end covers the image sensor chip;

a glass cover board, disposed within the accommodating space of the adapter; and

an actuator, disposed on the glass cover board, and having at least one optical lens, wherein the movement of the actuator is controlled by the image signal processor, so as to accomplish self-focusing.

3. The image sensor module as claimed in claim 2, wherein the glass cover board is a filter.

4. The image sensor module as claimed in claim 2, further comprising a housing, wherein the housing is disposed on the substrate;

the adapter, the glass cover board and the actuator are accommodated within the housing.

5. The image sensor module as claimed in claim 4, wherein the substrate further comprises at least one positioning pin, the housing has at least one positioning hole corresponding to the positioning pin, and the positioning pin is inserted into the positioning hole, so as to position the housing and the substrate.

6. The image sensor module as claimed in claim 1, wherein the depth of the concave is larger than the thickness of the image signal processor.

7. The image sensor module as claimed in claim 1, wherein the substrate further has at least one vent hole formed on the bottom of the concave and penetrating through the substrate.

8. The image sensor module as claimed in claim 1, wherein the substrate is suitable for being electrically connected to a flexible circuit substrate.

9. The image sensor module as claimed in claim 1, wherein the image signal processor comprises an image signal processing chip, a plurality of wire-bonding wires and a molding compound, wherein the image signal processing chip is electrically connected to the substrate via the wire-bonding wires, and the molding compound covers the image signal processing chip and the wire-bonding wires.

10. The image sensor module as claimed in claim 1, wherein the substrate further has a positioning concave located on the outer periphery of the concave, for supporting the supporting board.

11. The image sensor module as claimed in claim 1, wherein the supporting board is a heat sink.

12. The image sensor module as claimed in claim 1, further comprising a plurality of wire-bonding wires, wherein the image sensor chip is electrically connected to the substrate via the wire-bonding wires.