Wafer Bonding Method

• US 20080048313A1
• Filed: 10/23/2007
• Published: 02/28/2008
• Est. Priority Date: 05/10/2005
• Status: Active Grant

• Current Assignee: Kirby Sand
• Original Assignee: Kirby Sand
• Inventors: Sand, Kirby
• Granted Patent: US 8,390,111 B2
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.

Claims

1-9. -9. (canceled)

10. A micro-electronic component, comprising:

a substrate including micro-electronic devices thereon; and

a cover including a ring of sealing material secured to said substrate and a raised ring of material positioned opposite said cover from said ring of sealing material.

11. The component of claim 10 wherein said raised ring of material is substantially aligned with said ring of sealing material.

12. The component of claim 10 wherein cover is secured to said substrate by a substantially planar bonding platen that contacts said cover only at said raised ring of material.

13. The component of claim 12 wherein a force of said bonding platen is applied to said substrate only at said raised ring of material during securing of said ring of sealing material to said substrate.

14. The component of claim 10 wherein said cover is manufactured of glass.

15. The component of claim 10 wherein said micro-electronic components are positioned inwardly of said ring of sealing material and are hermetically sealed by said cover, said substrate, and said ring of sealing material.

16. The component of claim 10 wherein said device is a MEMS device.

17. A micro-electronic component, comprising:

a substrate including micro-electronic components positioned thereon;

means for covering said micro-electronic components;

means for sealing said means for covering to said substrate; and

means for localizing a sealing force applied to said means for sealing, said means for localizing positioned opposite said means for covering from and aligned with said means for sealing.

18. The component of claim 17 wherein said means for sealing and said means for localizing are initially secured to said means for covering and then said means for covering is secured to said substrate.

19. The component of claim 17 wherein said means for sealing is initially secured to said substrate and said means for localizing is initially secured to said means for covering and thereafter said means for covering is secured to said substrate.

20. The component of claim 17 wherein said means for sealing and said means for localizing each substantially surround a central region of said substrate including said micro-electronic components therein.

21. A micro electrical mechanical system, comprising:

a substrate including micro electrical devices;

a cover;

a seal ring positioned between and sealing together said cover and said substrate; and

a raised region positioned opposite said cover from said seal ring and being adapted to apply a localized force to said cover only in said raised region.

22. The system of claim 21 wherein said raised region is substantially aligned with said seal ring such that said raised region is adapted to apply a localized force to said cover at said seal ring.

23. The system of claim 21 wherein said raised region is formed of a pliable material such that said raised region gimbals a bonding platen thereon during securing of said cover to said substrate.

24. A method of wafer bonding, comprising:

positioning a wafer in a bonding position;

positioning a cover adjacent said wafer;

providing a seal material in a selected region between said wafer and said cover;

providing a raised region of bonding material opposite said cover from said seal material, said bonding material aligned with said seal material; and

applying a bonding force only to said bonding material so as to seal said sealing material to said wafer and to said cover only in said selected region.

25. The method of claim 24 wherein said step of applying a force comprises moving a substantially planar bonding platen toward said cover wherein said bonding platen contacts only said raised region of bonding material.

26. The method of claim 24 wherein said bonding force is transferred through said cover from said bonding material to said seal material.

27. The method of claim 24 wherein said raised region of bonding material is formed on said cover by lithographic deposition and etch processes.

28. The method of claim 27 wherein said raised region of bonding material is formed simultaneously with formation of alignment targets on said cover.

29. The method of claim 24 wherein said raised region of bonding material extends continuously around a perimeter of said cover.

30. The method of claim 24 wherein said wafer includes micro electrical components that extend upwardly a first distance from a bonding surface of said wafer, and wherein said seal material spaces said cover from said wafer by a second distance greater than said first distance.

31. The method of claim 24 wherein said raised region of bonding material is manufactured of a deformable material such that said bonding material provides a uniform distribution of force to said cover in said selected region when said bonding force is applied to said bonding material.

32. The method of claim 24 wherein said raised region of bonding material is formed on a bonding platen and wherein said raised region of bonding material contacts said cover during said applying a bonding force.