Method for low temperature bonding and bonded structure

  • US 20080053959A1
  • Filed: 10/31/2007
  • Published: 03/06/2008
  • Est. Priority Date: 02/16/2000
  • Status: Active Grant
First Claim
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1. A bonding method, comprising:

  • forming first and second bonding surfaces on first and second materials, respectively, at least one of said surfaces comprising an insulating material;

    enhancing activation of one of said first and second bonding surfaces;

    terminating said first and second bonding surfaces with a species allowing formation of chemical bonds;

    bringing together said first and second bonding materials;

    removing a substantial portion of said first material to leave a remaining portion;

    forming a third bonding surface on said remaining portion;

    enhancing activation of one of said third bonding surface and a fourth surface of a third material;

    bringing together said third bonding surface with said fourth surface; and

    forming a chemical bond between said remaining portion and said third material.

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