MODULAR SELF-CAPPING WIDE FORMAT PRINT ASSEMBLY

• US 20080062221A1
• Filed: 11/06/2007
• Published: 03/13/2008
• Est. Priority Date: 07/15/1997
• Status: Active Grant

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Granted Patent: US 7,891,767 B2
• Time in Patent Office: Days
• US Class Current: 347/32
• CPC Class Codes: B41J 2/155 for line printing
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 29/02 Framework
• CPC Class Codes: B41J 29/38 Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
• CPC Class Codes: B41J 29/393 Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns

Abstract

A wide format print assembly is provided. The print assembly includes a plurality of printhead modules each having a printhead integrated circuit (IC). Each module has a plurality of micro-electromechanical nozzle arrangements on a wafer substrate for operatively ejecting printing fluid onto a print medium. Each module also has a capping device displaceable between a capping position to cap the nozzle arrangements and an operative position where the nozzle arrangements are exposed for printing The modules also have a printed circuit board (PCB) linked to a CMOS drive circuitry layer on the wafer substrate. The print assembly includes a plurality of ink reservoir moldings to supply the printhead modules with printing fluid, and control circuitry for controlling the nozzle arrangements via the printed circuit boards.

Claims

1. A wide format print assembly comprising:

a support structure;

a plurality of printhead modules mounted serially on the support structure, each printhead module having a printhead integrated circuit (IC) comprising a plurality of micro-electromechanical nozzle arrangements on a wafer substrate for operatively ejecting printing fluid onto a print medium, said modules also each having a capping device displaceable between a capping position to cap the nozzle arrangements and an uncapping position where the nozzle arrangements are exposed for printing, and each module having a printed circuit board (PCB) linked to a CMOS drive circuitry layer on the wafer substrate;

a plurality of ink reservoir moldings to supply the printhead modules with printing fluid; and

control circuitry for controlling the nozzle arrangements via the printed circuit boards.

2. The print assembly of claim 1, wherein the printhead ICs together include at least one hundred thousand nozzle arrangements.

3. The print assembly of claim 2, wherein the printhead ICs together include at least two hundred thousand nozzle arrangements.

4. The print assembly of claim 1, having between forty and one hundred printhead ICs.

5. The printhead assembly of claim 1, having a camshaft driven by a motor controlled by the control circuitry, said camshaft interconnecting the capping devices via a translating member, so that rotational movement of the camshaft results in reciprocal movement of the capping devices between their capping and uncapping positions.

6. The printhead assembly of claim 1, in which the PCB includes print engine controller circuitry which is linked to the CMOS drive circuitry layer.

7. The printhead assembly of claim 6, in which the print engine controller circuitry is configured to drive the nozzle arrangements at a cyclical rate of up to 80 Hz.