Optical Semiconductor Device And Method Of Manufacturing Thereof

• US 20080070333A1
• Filed: 09/15/2005
• Published: 03/20/2008
• Est. Priority Date: 09/22/2004
• Status: Active Grant

• Current Assignee: Dow Corning Toray Company Limited (Dow, Inc.)
• Original Assignee: Dow Corning Toray Company Limited (Dow, Inc.)
• Inventors: Morita, Yoshitsugu, Kato, Tomoko
• Granted Patent: US 7,651,887 B2
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: B29C 33/68 Release sheets
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: B29C 43/50 Removing moulded articles
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/566 Release layers for moulds, e.g. release layers, layers against residue during moulding
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01044 : Ruthenium [Ru]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01059 : Praseodymium [Pr]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A method of manufacturing an optical semiconductor device (16) sealed in a transparent or semitransparent cured silicone body (50) by placing an unsealed optical semiconductor device (16) into a mold (23, 34) and subjecting a transparent or semitransparent curable silicone composition (50) that fills the spaces between the mold and the unsealed device (70) to compression molding; provides the sealed optical semiconductor device that is free of voids, allows control of the coating layer thickness, protects the bonding wires from breakage and accidental contact, reduces concentration of stress on an optical semiconductor element, has long service life with reducing discoloration and disconnection of the sealing resin from the optical semiconductor element (16), and has excellent reliability.

Claims

1. A method of manufacturing an optical semiconductor device sealed in a transparent or semitransparent cured silicone body by placing an unsealed optical semiconductor device into a mold and subjecting a transparent or semitransparent curable silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding.

2. The method of claim 1, wherein after the optical semiconductor device is placed into a lower mold and the transparent or semitransparent curable silicone composition is fed into a space between an upper mold and the unsealed optical semiconductor device, the unsealed semiconductor device is clamped between the upper mold and the lower mold, and the curable silicone composition is subjected to compression molding.

3. The method of claim 1, wherein at least two optical semiconductor devices are sealed, and then the obtained sealed assembly is cut into separate sealed semiconductor devices.

4. The method of claim 1, wherein a release film is applied to the inner surface of the mold.

5. The method of claim 4, wherein the release film is held against the inner surface of the mold by air suction.

6. The method of claim 1, wherein the semiconductor device comprises optical semiconductor elements on a printed circuit board, the elements being electrically connected via bonding wires.

7. The method of claim 1, wherein the sealed optical semiconductor device is a light-emitting diode.

8. The method of claim 1, wherein the cured silicone body has visible light transmittance of 90% or more.

9. The method of claim 1, wherein the curable silicone composition is a hydrosilylation-curable silicone composition.

10. The method of claim 9, wherein the hydrosilylation-curable silicone composition comprises at least the following components:

(A) an organopolysiloxane represented by the following average unit formula;

R¹_aSiO_(4-a)/2

where R¹ is a substituted or unsubstituted univalent hydrocarbon group with 1 to 10 carbon atoms, with the proviso that 20 mole % or more of all R¹'"'"'s in one molecule are phenyl groups and at least two R¹'"'"'s are alkenyl groups; and

“

a”

is a number that satisfies the following condition;

0.5≦

a≦

2.2;

(B) an organohydrogenpolysiloxane represented by the following average unit formula;

R²_bH_cSiO_(4-b-c)/2

where R² is a substituted or unsubstituted univalent hydrocarbon group with 1 to 10 carbon atoms with the exception of an alkenyl group, and both “

b” and

“

c”

are numbers that satisfy the following conditions;

1.0<

b<

2.2;

0.002<

c<

1; and

1.0<

(b+c)<

3.0; and

(C) a hydrosilylation-reaction catalyst.

11. A sealed optical semiconductor device produced by the method according to claim 1.