Methods and apparatuses for directing an ion beam source

• US 20080073557A1
• Filed: 07/26/2006
• Published: 03/27/2008
• Est. Priority Date: 07/26/2006
• Status: Abandoned Application

• Current Assignee: General Plasma, Inc. (BASF SE)
• Original Assignee: General Plasma, Inc. (BASF SE)
• Inventors: German, John, Hartig, Klaus, Madocks, John E.
• Application Number:
  US11/493,703
• Publication Number:
  US 20080073557A1
• Time in Patent Office: Days
• US Class Current: 250/424
• CPC Class Codes: C23C 14/221 Ion beam deposition C23C14/46, C23C14/48 take precedence
• CPC Class Codes: C23C 14/225 Oblique incidence of vaporised material on substrate
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01J 2237/061 Construction
• CPC Class Codes: H01J 2237/083 Beam forming
• CPC Class Codes: H01J 2237/3151 Etching
• CPC Class Codes: H01J 27/143 Hall-effect ion sources with closed electron drift
• CPC Class Codes: H01J 37/08 Ion sources; Ion guns

Abstract

A method and apparatus for directing an ion beam toward a surface of a substrate is disclosed. Certain embodiments of the invention relate generally to ion beam sources adapted to direct ion beams toward a surface of a substrate at an oblique angle of incidence relative to the surface. Certain embodiments of the invention are adapted to direct two ion beam portions toward a substrate surface, the ion beam portions having substantially equal throw distances. Preferred embodiments of the invention may be useful in etching applications, where the angle of incidence and throw distance of two ion beam portions are well suited for etching the surface of a substrate.

Claims

1. An ion beam source with a closed-loop ion-emitting slit capable of emitting an ion beam toward a substrate surface, the ion beam source comprising:

a housing including a cathode inner portion and a cathode outer portion, the outer portion extending around the inner portion and being spaced from the inner portion to form the closed-loop slit therebetween, the housing having a longitudinal axis and a transverse axis, said axes defining an operating plane, the closed-loop slit forming a slit plane that is oblique to the operating plane;

an anode disposed within the housing proximate the slit;

an electric power supply adapted to apply a voltage to the anode to form an electric field in an ionization region proximate the slit;

a magnetic element adapted to generate magnetic lines of flux that pass through the slit, the cathode inner and outer portions, and the magnetic element to form a closed-loop magneto-conductive circuit; and

a gas supply adapted to deliver a working medium into the housing to form a collimated ion beam that is emitted from the slit when the working medium passes through the ionization region, the ion beam having an ion beam direction that is substantially orthogonal to the slit plane such that the ion beam direction is oblique to the operating plane, the ion beam direction being defined by a centerline of the ion beam.

2. The ion beam source of claim 1 wherein the ion beam source has a front face that is at least generally parallel to the substrate surface.

3. The ion beam source of claim 2 wherein the ion beam source is mounted such that its front face is within a mean-free-path distance of the ion beam from the substrate surface.

4. The ion beam source of claim 2 wherein the ion beam source is mounted such that its front face is less than one inch from the substrate surface.

5. The ion beam source of claim 1 wherein the magnetic element is adapted to form a magnetic mirror field in the slit, the magnetic mirror field having a minimum magnetic mirror ratio of greater than about 2.

6. The ion beam source of claim 1 wherein the ion-emitting slit has two long sections that are at least generally parallel to each other, and wherein ion beam portions emitted from the two long sections of the slit have substantially equal throw distances.

7. The ion beam source of claim 6 wherein the ion beam portions emitted from the two long sections of the slit form a divergent pattern as they move toward the substrate surface.

8. The ion beam source of claim 6 wherein the ion beam portions emitted from the two long sections of the slit form a convergent pattern as they move toward the substrate surface.

9. The ion beam source of claim 6 wherein the ion beam portions emitted from the two long sections of the slit are substantially parallel to each other as they move toward the substrate surface.

10. The ion beam source of claim 6 wherein said throw distance is less than about 3 inches.

11. The ion beam source of claim 6 wherein said throw distance is between about 0.5 and about 2.5 inches.

12. The ion beam source of claim 6 wherein said throw distance is about 1 inch or less.

13. The ion beam source of claim 1 wherein the ion beam direction forms an angle of incidence of between about 10 and about 80 degrees.

14. The ion beam source of claim 1 wherein the ion beam direction forms an angle of incidence of between about 30 and about 70 degrees.

15. The ion beam source of claim 1 wherein the ion beam direction forms an angle of incidence of between about 55 and about 70 degrees.

16. The ion beam source of claim 1 wherein the ion beam direction forms an angle of incidence of between about 63 and about 67 degrees.

17. The ion beam source of claim 1 wherein the ion beam source is provided, in combination, with a conveying system defining a path of substrate travel, the ion beam source being disposed at a lower elevation than the path of substrate travel.

18. The ion beam source of claim 17 wherein the ion beam source is disposed at a lower elevation than the path of substrate travel and yet is mounted to a top lid of a vacuum deposition chamber through which the path of substrate travel extends, the path of substrate travel being defined by a plurality of transport rollers, and wherein the top lid and the ion beam source are adapted to be removed as an integral unit by lifting the top lid off the vacuum deposition chamber thereby moving the ion beam source upwardly between two adjacent ones of the transport rollers.

19. The ion beam source of claim 17 wherein the source is adapted to create a beam spread along the transverse axis, the beam spread being less than a distance between two adjacent transport rollers of the conveying system, such that the ion beam can be emitted upwardly between such two adjacent transport rollers.

20. The ion beam source of claim 1 wherein the ion beam source is adapted to create a beam spread along the transverse axis, the beam spread being less than about 20 inches.

21. The ion beam source of claim 1 wherein the ion beam source is adapted to create a beam spread along the transverse axis, the beam spread being less than about 10 inches.

22. The ion beam source of claim 1 wherein the ion beam source is adapted to create a beam length along the longitudinal axis, the beam length being greater than about 12 inches.

23. The ion beam source of claim 1 wherein the ion beam source is adapted to create a beam length along the longitudinal axis, the beam length being greater than about 75 inches.

24. The ion beam source of claim 1 further comprising a debris shield adapted to keep foreign objects from falling vertically downwardly into the slit.

25. The ion beam source of claim 24 wherein the debris shield comprises a low work function material capable of tolerating high temperatures and adapted to emit electrons.

26. The ion beam source of claim 24 wherein the debris shield comprises tungsten.

27. The ion beam source of claim 24 wherein the debris shield comprises thorium.

28. The ion beam source of claim 24 wherein the debris shield comprises thoriated iridium.

29. The ion beam source of claim 24 wherein the debris shield is positioned directly above, and at least partially covers, the slit.

30. The ion beam source of claim 29 wherein the debris shield extends from the cathode inner portion to at least partially cover the slit.

31. The ion beam source of claim 1 wherein the working medium comprises gas selected from the group consisting of oxygen, nitrogen, and argon.

32. The ion beam source of claim 1 wherein the working medium comprises CF₄.

33. The ion beam source of claim 1 wherein the working medium comprises an inert gas.

34. The ion beam source of claim 1 wherein the working medium comprises a halogen.

35. The ion beam source of claim 1 wherein the working medium comprises a halide.

36. A method of directing an ion beam toward a substrate surface, the method comprising:

providing a housing including a cathode inner portion and a cathode outer portion, the outer portion extending around the inner portion and being spaced from the inner portion to form a closed-loop slit therebetween, the housing having a longitudinal axis and a transverse axis together defining an operating plane, the closed-loop slit forming a slit plane that is oriented at an oblique angle relative to the operating plane;

providing an anode within the housing proximate the slit;

supplying a positive voltage to the anode to form an electric field in an ionization region proximate the slit;

generating magnetic lines of flux that pass through the slit, and through the cathode inner and outer portions to form a closed-loop magneto-conductive circuit; and

supplying a working medium into the housing to form a collimated ion beam that is emitted from the slit when the working medium passes through the ionization region, the ion beam having an ion beam direction that is substantially orthogonal to the slit plane such that the ion beam direction is oriented at an oblique angle relative to the substrate surface, the ion beam direction being defined by a centerline of the ion beam.

37. The method of claim 36 wherein the slit has two long sections from which two ion beam portions are emitted respectively, said two ion beam portions having substantially equal throw distances.

38. The method of claim 37 wherein the two long sections of the slit are at least generally parallel to each other.

39. The method of claim 37 wherein the two ion beam portions emitted respectively from the two long sections of the slit form a divergent pattern as they move toward the substrate surface.

40. The method of claim 36 comprising orienting the angle of the slit plane relative to the operating plane such that the ion beam direction forms an angle of incidence of between about 10 and about 80 degrees.

41. The method of claim 36 comprising controlling the angle of the slit plane relative to the operating plane such that the ion beam direction forms an angle of incidence of between about 60 and about 70 degrees.

42. The method of claim 36 wherein the ion beam impinges the substrate surface and is adapted to provide a removal rate of at least about 4300 angstrom-inches per minute for clear soda-lime glass.

43. The method of claim 36 wherein the ion beam impinges the substrate surface and is adapted to provide a removal rate of at least about 5000 angstrom-inches per minute for clear soda-lime glass.

44. The method of claim 36 wherein the ion beam impinges the substrate surface and is adapted to provide a removal rate of at least about 7000 angstrom-inches per minute for clear soda-lime glass.

45. The method of claim 36 wherein the ion beam impinges the substrate surface and is adapted to provide a removal rate of at least about 20,000 angstrom-inches per minute for clear soda-lime glass.

46. The method of claim 36 wherein the ion beam impinges the substrate surface, removing a dielectric film from the substrate surface.

47. The method of claim 36 comprising operating the ion beam source to create a beam spread along the transverse axis, the beam spread being less than a distance between two adjacent transport rollers of a conveying system such that the ion beam is emitted upwardly between the two adjacent transport rollers to impinge the substrate surface.

48. The method of claim 36 wherein the positive voltage is greater than about 1000 volts.

49. The method of claim 36 wherein the positive voltage is greater than about 3000 volts.

50. The method of claim 36 wherein the positive voltage is greater than about 5000 volts.

51. The method of claim 36 wherein the positive voltage is greater than about 12,000 volts.

52. The method of claim 36 wherein a plasma is formed from the working medium, the plasma being centered within the slit by establishing a magnetic mirror confinement region.

53. The method of claim 36 wherein the working medium is oxygen.

54. The method of claim 36 wherein the working medium comprises a dopant for minimizing pole erosion.

55. The method of claim 54 wherein the dopant causes material to be deposited on poles of the ion beam source at substantially the same rate at which the ion beam source removes material from the poles.

56. The method of claim 54 wherein the dopant comprises a hydrocarbon gas.

57. The method of claim 54 wherein the dopant comprises methane.

58. The ion beam source of claim 36 wherein the ion beam emitted from the ion beam source includes two beam portions that form a convergent pattern as they move toward the substrate surface.

59. The ion beam source of claim 36 wherein the ion beam emitted from the ion beam source includes two beam portions that are substantially parallel to each other.

60. A method of processing a substrate, the method comprising:

depositing a first coating over a first major surface of the substrate, wherein during the deposition of the first coating, an overspray of material is deposited on a second major surface of the substrate, the first and second major surfaces being generally opposed;

etching the second major surface of the substrate to remove at least some of the overspray;

wherein said etching comprises directing a collimated ion beam toward the second major surface, the ion beam being emitted from an ion beam source having a slit with two long sections that are at least generally parallel to each other, wherein two ion beam portions emitted respectively from the two long sections of the slit form a divergent pattern and have substantially equal throw distances.

61. The method of claim 60 wherein said etching includes:

providing a housing including a cathode inner portion and a cathode outer portion, the outer portion extending around the inner portion and being spaced from the inner portion to form the slit therebetween, the housing having a longitudinal axis and a transverse axis together defining an operating plane, the slit forming a slit plane that is oriented at an oblique angle relative to the operating plane;

providing an anode within the housing proximate the slit;

supplying a positive voltage to the anode to form an electric field in an ionization region proximate the slit;

generating magnetic lines of flux which pass through the anode, slit, and cathode inner and outer portions to form a closed-loop magneto-conductive circuit; and

supplying a working medium into the housing to form said ion beam, wherein said ion beam is emitted from the slit when the working medium passes through the ionization region, said ion beam having an ion beam direction that is substantially orthogonal to the slit plane such that the ion beam direction is oriented at an oblique angle relative to the second major surface of the substrate, the ion beam direction being defined by a centerline of the ion beam.

62. A coater having a series of serially connected vacuum deposition chambers, wherein the coater has a path of substrate travel defined by a plurality of transport rollers, the coater having an ion beam source located beneath the path of substrate travel, the ion beam source having a slit with two long sections that are at least generally parallel to each other, the ion beam source being adapted to emit an ion beam having two portions that emanate respectively from the two long sections of the slit, wherein the ion beam source is configured such that said two portions of the ion beam have substantially equal throw distances and form a divergent pattern when moving toward the path of substrate travel, the ion beam source being adapted to emit the ion beam upwardly between two adjacent ones of the transport rollers.

63. The coater of claim 62 wherein the ion beam source is mounted to a top lid of a desired one of the vacuum deposition chambers such that the ion beam source can be removed from said desired vacuum deposition chamber by lifting the top lid off said desired vacuum deposition chamber.

64. A coater having a series of serially connected vacuum deposition chambers, the coater having a path of substrate travel adapted for conveying a large-area substrate having a width of at least 1.5 meters, the path of substrate travel being defined by a plurality of transport rollers, the coater having an ion beam source that is located beneath the path of substrate travel and yet is mounted to a top lid of a desired one of the vacuum deposition chambers, wherein the ion beam source and the top lid can be removed from said desired vacuum deposition chamber as an integral unit by lifting the top lid off said desired vacuum deposition chamber thereby passing the ion beam source upwardly between two adjacent ones of the transport rollers.