Device and method for reducing crosstalk

• US 20080081492A1
• Filed: 09/13/2007
• Published: 04/03/2008
• Est. Priority Date: 09/29/2006
• Status: Active Grant

• Current Assignee: Covidien LP (Medtronic Plc)
• Original Assignee: Nellcor Puritan Bennett Incorporated (Medtronic Plc)
• Inventors: Mannheimer, Paul D., Chew, Bradford B., Sawatari, Ken
• Granted Patent: US 7,794,266 B2
• Time in Patent Office: Days
• US Class Current: 439/83
• CPC Class Codes: A61B 2562/222 Electrical cables or leads therefor, e.g. coaxial cables or ribbon cables
• CPC Class Codes: A61B 5/1455 using optical sensors, e.g. spectral photometrical oximeters
• CPC Class Codes: H01R 13/6461 Means for preventing cross-talk
• CPC Class Codes: H01R 13/65915 Twisted pair of conductors surrounded by shield
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence

Abstract

A device and method for reducing crosstalk between wires is provided. The method includes spatially separating first and second sets of wires. A device is disposed relative to the first and second sets of wires to maintain the spatial separation. The method also comprises coupling pins to the first and second sets of wires. Additionally, the method includes covering the device with a connector housing.

Claims

1. A method of manufacturing an electrical cable comprising:

spatially separating a first set of wires from a second set of wires;

disposing a device relative to the first and second sets of wires to maintain the spatial separation;

coupling pins to the first and second sets of wires; and

covering the device with a connector housing.

2. The method of claim 1, wherein disposing the device comprises passing the first set of wires through a first aperture of the device and passing the second set of wires through a second aperture of the device.

3. The method of claim 1, wherein disposing the device comprises coupling the first and second sets of wires to the device, wherein the device comprises a printed circuit board.

4. The method of claim 3, comprising coupling the pins to the printed circuit board to electrically couple the first and second sets of wires to the pins.

5. The method of claim 4, wherein coupling the pins to the printed circuit board comprises inserting the printed circuit board in between the pins and soldering the pins to the printed circuit board.

6. The method of claim 1, wherein disposing a device comprises disposing the first set of wires in an first open ended aperture on a first side of the device and disposing the second set of wires in a second open ended aperture on a second side of the device.

7. The method of claim 1, wherein disposing the device comprises coupling the first and second sets of wires to an insulative object, the insulative object having a first set of conductive traces disposed on a first side of the insulative object and a second set of conductive traces disposed on a second side of the insulative object.

8. The method of claim 1, wherein disposing the device comprises disposing a conductive piece in between the wires, the conductive piece being coupled to ground.

9. The method of claim 1, wherein disposing a device comprises disposing the wires in a dielectric gel and allowing the gel to cure while the wires are spatially separated.

10. The method of claim 1, comprising stripping the cable to expose the first and second sets of wires.

11. The method of claim 1, wherein covering the device with a connector housing comprises an over-molding process.

12. The method of claim 1, wherein covering the device with a connector housing comprises an assembly of pre-configured components.