APPARATUS AND METHOD FOR REACTIVE ATOM PLASMA PROCESSING FOR MATERIAL DEPOSITION

• US 20080099441A1
• Filed: 12/20/2007
• Published: 05/01/2008
• Est. Priority Date: 11/07/2001
• Status: Active Grant

• Current Assignee: Imreal Enterprises, LLC
• Original Assignee: Rapt Industries, Inc.
• Inventors: Carr, Jeffrey
• Granted Patent: US 7,955,513 B2
• Time in Patent Office: Days
• US Class Current: 216/67
• CPC Class Codes: C23C 16/0245 by etching with a plasma
• CPC Class Codes: C23C 16/047 using irradiation by energy or particles
• CPC Class Codes: C23C 16/513 using plasma jets
• CPC Class Codes: H01J 37/32376 Scanning across large workpieces
• CPC Class Codes: H01L 21/31051 Planarisation of the insulating layers H01L21/31058 takes precedence
• CPC Class Codes: H05H 1/30 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/28 takes precedence

Abstract

A method for shaping a surface of a workpiece, comprises positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes. A plasma gas is introduced to an outer tube of the ICP torch and energy is transferred from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch. A reactive reactive precursor is introduced to the excitation zone, and an auxiliary gas is introduced to the intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed. The surface is shaped by removing material from the surface of the workpiece with at least a portion of the reactive species and adding material to the surface of the workpiece with at least a portion of the reactive species.

Claims

1. A method for shaping a surface of a workpiece, comprising:

positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes;

introducing a plasma gas to an outer tube of the ICP torch;

transferring energy from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch;

introducing a reactive precursor to the excitation zone;

introducing an auxiliary gas to an intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed;

removing material from the surface of the workpiece with at least a portion of the reactive species; and

adding material to the surface of the workpiece with at least a portion of the reactive species.

2. A method according to claim 1, further comprising:

altering the chemistry of the surface of the workpiece with at least a portion of the reactive species.

3. A method according to claim 1, wherein the removing and adding steps causes minimal or no damage to the workpiece underneath the surface.

4. A method according to claim 1, further comprising:

rotating the workpiece with respect to the plasma torch.

5. A method according to claim 1, further comprising:

controlling the mass flow of a precursor into the plasma from between about 0 ml/min to about 2,000 ml/min.

6. A method according to claim 1, further comprising:

controlling the mass flow of the reactive precursor into the plasma from between about 0 ml/min to about 50,000 ml/min.

7. A method according to claim 1, further comprising:

coupling energy to the excitation zone in an annular region of the plasma torch.

8. A method according to claim 1, further comprising:

using the auxiliary gas to keep hot plasma away from a central channel of the plasma torch.

9. A method according to claim 1, further comprising:

introducing the plasma gas to the outer tube tangentially.

10. A method according to claim 1, further comprising:

maintaining the temperature of the plasma between 5,000 and 15,000 degrees C.

11. A method according to claim 1, further comprising:

producing a volatile reaction on the surface of the workpiece.

12. A method according to claim 1, further comprising maintaining the ICP torch and the workpiece at about atmospheric pressure.

13. A method according to claim 1, further comprising:

using the reactive precursor to control the etch rate of the plasma, the reactive precursor being any one of a solid, liquid, or gas.

14. A method for cleaning a surface, comprising:

positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes;

introducing a plasma gas to an outer tube of the ICP torch;

transferring energy from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch;

introducing a reactive precursor to the excitation zone;

introducing an auxiliary gas to an intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed;

depositing material to the surface of the workpiece with at least a portion of the reactive species; and

removing material from the surface of the workpiece with at least a portion of the reactive species.

15. A method for redistributing a material on a surface, comprising:

positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes;

introducing a plasma gas to an outer tube of the ICP torch;

transferring energy from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch;

introducing a reactive precursor to the excitation zone;

introducing an auxiliary gas to an intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed;

depositing material to the surface of the workpiece with at least a portion of the reactive species; and

redistributing material from the surface of the workpiece with at least a portion of the reactive species.