Valve, circuit module and method providing integrated electronics in an electronically controlled valve and electronic assemblies

• US 20080099714A1
• Filed: 10/25/2007
• Published: 05/01/2008
• Est. Priority Date: 10/25/2006
• Status: Abandoned Application

• Current Assignee: Enfield Technologies, LLC
• Original Assignee: Enfield Technologies, LLC
• Inventors: Cook, Daniel S.
• Application Number:
  US11/977,519
• Publication Number:
  US 20080099714A1
• Time in Patent Office: Days
• US Class Current: 251/341
• CPC Class Codes: F15B 13/0402 for linearly sliding valves, e.g. spool valves
• CPC Class Codes: F15B 13/0446 with moving coil, e.g. voice coil
• CPC Class Codes: F16K 11/07 with cylindrical slides
• CPC Class Codes: F16K 27/041 cylindrical slide valves
• CPC Class Codes: F16K 27/048 Electromagnetically actuated valves
• CPC Class Codes: F16K 31/02 electric F16K31/004 takes precedence; magnetic
• CPC Class Codes: F16K 31/04 using a motor
• CPC Class Codes: F16K 31/0613 with cylindrical slides
• CPC Class Codes: F16K 37/0041 for measuring valve parameters F16K37/0033 takes precedence
• CPC Class Codes: H01F 7/1844 Monitoring or fail-safe circuits for relays H01H47/002
• CPC Class Codes: Y10S 251/905 Movable coil electrical actuator, e.g. voice coil
• CPC Class Codes: Y10T 137/0396 Involving pressure control
• CPC Class Codes: Y10T 137/2529 With electrical controller
• CPC Class Codes: Y10T 137/7761 Electrically actuated valve
• CPC Class Codes: Y10T 137/86614 Electric
• CPC Class Codes: Y10T 137/86622 Motor-operated
• CPC Class Codes: Y10T 137/87217 Motor

Abstract

A valve is described. The valve includes a valve body that at least partially defining a valve envelope and a plurality of circuit substrates which is disposed within the valve envelope. At least one circuit substrates in the plurality of circuit substrates includes circuitry for controlling the valve. A circuit module is also described. A method is described for integrating circuit modules into a plurality of arrangements to provide various electronic functions and applications; these applications may be incorporated into a valve body, in support of a more complex electronic assembly, or as stand-alone electronic assemblies.

Claims

1. A valve comprising:

a valve body at least partially defining a valve envelope; and

a plurality of circuit substrates disposed within the valve envelope;

wherein at least one of the plurality of circuit substrates comprises circuitry for controlling the valve.

2. The valve as in claim 1, further comprising a cover that further defines the valve envelope.

3. The valve as in claim 2, wherein the cover further comprises a connector and wherein at least one of the circuit substrates within the plurality of circuit substrates is electrically connected to the connector.

4. The valve as in claim 1, wherein at least one of the plurality of circuit substrates provides a given functionality.

5. The valve as in claim 4, wherein the arrangement of the plurality of circuit substrates does not affect the functionality of the at least one circuit substrate.

6. The valve as in claim 1, wherein the circuit substrates within the plurality of circuit substrates are stacked top to bottom so as to have the same footprint.

7. The valve as in claim 6, wherein the circuit substrates within the plurality of circuit substrates may only be stacked according to a given orientation.

8. The valve as in claim 1, wherein the circuit substrates within the plurality of circuit substrates are electronically connected.

9. The valve as in claim 1, wherein a circuit substrate comprises an electrically insulated dielectric.

10. The valve as in claim 1, wherein the plurality of circuit substrates operate in cooperation with a controller that is external to the valve envelope.

11. The valve as in claim 1, wherein at least one of the plurality of circuit substrates comprises active circuit components.

12. A circuit module comprising:

at least two circuit substrate; and

circuitry for controlling a valve,

wherein the circuit substrate is configured to fit within a valve envelope that is at least partially defined by a valve body.

13. The circuit module as in claim 12, wherein the one of the circuit substrates provides a given functionality.

14. The circuit module as in claim 13, wherein the arrangement of the plurality of circuit substrates does not affect the functionality of the at least one circuit substrate.

15. The circuit module as in claim 12, wherein the at least one circuit substrate further comprises active circuit components.

16. The circuit module as in claim 12, wherein the circuit substrates within the plurality of circuit substrates are electronically connected.

17. The circuit module as in claim 12, wherein the module is further configured to be capable of being attached to a backplane of an external controller of the device.

18. A method comprising:

providing a valve body that at least partially defines a valve envelope; and

disposing a plurality of circuit substrates within the valve envelope;

wherein at least one circuit substrate of the plurality of circuit substrates comprises circuitry for controlling the valve.

19. The method as in claim 18, further comprising attaching a valve cover to the valve body such that the cover further defines the valve envelope,

wherein the valve cover provides an electrical connection to the circuit substrates within the envelope of the valve.

20. The method as in claim 18, wherein at least one circuit substrate of the plurality of circuit substrates provides a given functionality and wherein the at least one circuit substrate of the plurality of circuit substrates is selected according to the functionality provided.

21. The method as in claim 18, wherein one of the circuit substrates provides a given functionality, and

wherein the arrangement of the plurality of circuit substrates does not affect the functionality of the at least one circuit substrate.

22. The method as in claim 18, further comprising disposing another plurality of circuit substrates within a controller that is external to the valve envelope, where the plurality of circuit substrates disposed within the valve envelope operate in cooperation with the controller that is external to the valve envelope.

23. The method as in claim 22, wherein the circuit substrates are configured to fit within both the controller that is external to the valve envelope and the valve envelope.