IMPLANTABLE BIOCOMPATIBLE COMPONENT INTEGRATING AN ACTIVE SENSOR FOR MEASUREMENT OF A PHYSIOLOGICAL PARAMETER, A MICRO-ELECTROMECHANICAL SYSTEM OR AN INTEGRATED CIRCUIT

• US 20080102096A1
• Filed: 09/24/2007
• Published: 05/01/2008
• Est. Priority Date: 09/25/2006
• Status: Active Grant

• Current Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Original Assignee: Sorin CRM SAS
• Inventors: Ripart, Alain, Molin, Renzo
• Granted Patent: US 9,126,825 B2
• Time in Patent Office: Days
• US Class Current: 424/422
• CPC Class Codes: B81B 2201/06 Bio-MEMS
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals

Abstract

An implantable biocompatible component (10) integrating an active element of the type of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system and an integrated electronic circuit. This component (10) has a substrate (12) and a lid (22) in silicon or quartz. The substrate (12) integrates the active element (14) and biocompatible metallic pads (16), electrically connected to the active element. The lid (22) encompasses and peripherally closes the substrate in a hermetic manner, level with the face integrating the active element. This component is void of metallic case for insulation between the active element and outside environment, and of insulative feedthrough for electrical connection to the active element. The substrate and lid can be directly welded to each other through their faces in vis-à-vis, or by interpositioning a sealing ring made of a biocompatible material.

Claims

1. A biocompatible component implantable in the human body, comprising:

an active element of the type selected from among the group consisting of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system, and an integrated electronic circuit;

a base substrate made of silicon or quartz having a first face and a second face, said active element being integrated on said first face;

metal pads that are biocompatible relative to an external environment, formed on said second face of said substrate;

electrical connections integrated on the substrate for connecting said pads to the active element;

vias for connecting said metal pads to said conductors in contact with said active integrated element, said vias being hollowed through the substrate and filled with a metal; and

a lid made of silicon or quartz covering and peripherally enclosing said substrate in a hermetic manner, said lid being located on the side of said first face integrating the active element;

said component being essentially void of a metallic case for insulation between said active element and said external environment, and void of insulating feedthroughs for electronic connection to the active element.

2. The implantable biocompatible component of claim 1, wherein said substrate and lid are directly sealed to each other through their faces in vis-à

-vis.

3. The implantable biocompatible component of claim 1, further comprising a biocompatible sealing material interposed between the substrate face and the lid face wherein the substrate and lid are welded one to the other by said biocompatible material.

4. The implantable biocompatible component of claim 3, wherein the biocompatible sealing material further comprises a glass.

5. The implantable biocompatible component of claim 3, wherein the biocompatible sealing material further comprises one of a metal, a metallic alloy, gold, and palladium.

6. The implantable biocompatible component of claim 1, wherein said metallic pads are coated with gold.

7. The implantable biocompatible component of claim 1, wherein the integrated active element comprises radiofrequency (RF) circuits, and wherein at least one of said metallic pads comprises a configuration and dimensions so as to form an antenna for RF Transmissions.

8. The implantable biocompatible component of claim 7, wherein said RF circuits are remotely power-fed, and wherein at least one metallic pad comprises a configuration and dimensions so as to form an antenna for receiving a remote power feed.

9. The implantable biocompatible component of claim 1, wherein the active element further comprises a remotely power-fed circuit.

10. The implantable biocompatible component of claim 1, wherein the lid further comprises a Thin Film Packaging (TFP) lid.

11. The implantable biocompatible component of claim 1 wherein the lid further comprises a lid made according to a Thin Film Packaging process.

12. The implantable biocompatible active component of claim 1, wherein the substrate material and the lid material further comprise a boron-doped silicon.