Methods of cleaning a semiconductor device and methods of manufacturing a semiconductor device using the same
First Claim
Patent Images
1. A method of removing contaminates from a structure of a semiconductor device, wherein said structure comprises a metal, said method comprising:
- cleaning said device with a first cleaning solution, said first cleaning solution comprising a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2) and deionized (DI) water; and
cleaning said device with a second cleaning solution, said second cleaning solution comprising ozone (O3) water or hydrogen fluoride (HF),whereby contaminants are removed from said structure of said semiconductor device.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention provides methods of cleaning a semiconductor device by removing contaminants, such as particles and/or etching by-products, from a structure of a semiconductor device using a first cleaning solution including a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2) and deionized (DI) water, and a second cleaning solution including ozone (O3) water. The present invention also provides methods of manufacturing a semiconductor device using these methods of cleaning the semiconductor device.
15 Citations
20 Claims
-
1. A method of removing contaminates from a structure of a semiconductor device, wherein said structure comprises a metal, said method comprising:
-
cleaning said device with a first cleaning solution, said first cleaning solution comprising a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2) and deionized (DI) water; and cleaning said device with a second cleaning solution, said second cleaning solution comprising ozone (O3) water or hydrogen fluoride (HF), whereby contaminants are removed from said structure of said semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A method of manufacturing a semiconductor device, comprising:
-
forming an insulation layer and a conductive layer on a semiconductor substrate; forming a gate pattern, said gate pattern comprising a metal, by sequentially etching the conductive layer and the insulation layer, the gate pattern comprising an insulation layer pattern and a conductive layer pattern; cleaning said device with a first cleaning solution, said first cleaning solution comprising a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2) and deionized (DI) water; and cleaning said device with a second cleaning solution, said second cleaning solution comprising ozone (O3) water or hydrogen fluoride (HF), to thereby manufacture said semiconductor device. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
-
Specification