Image sensor assembly for optical reader

• US 20080128511A1
• Filed: 08/23/2007
• Published: 06/05/2008
• Est. Priority Date: 07/08/1998
• Status: Active Grant

• Current Assignee: Hand Held Products Incorporated (Honeywell International Inc.)
• Original Assignee: Hand Held Products Incorporated (Honeywell International Inc.)
• Inventors: Schwartz, Eric D., Beckhusen, Gerard, Lacey, Michael P., Hinkley, Robert C., Hunter, Vivian L., McCall, Melvin D., Hennick, Robert J., Jovanovski, Brian L., Hubben, Edward B.
• Granted Patent: US 8,096,472 B2
• Time in Patent Office: Days
• US Class Current: 235/462.43
• CPC Class Codes: G06K 7/10722 Photodetector array or CCD scanning
• CPC Class Codes: G06K 7/10732 Light sources
• CPC Class Codes: G06K 7/10742 including a diffuser for diffusing the light from the light source to create substantially uniform illumination of the target record carrier
• CPC Class Codes: G06K 7/10881 constructional details of hand-held scanners
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

There is described an optical assembly. In one aspect, the optical assembly can be used in an optical reader. In another aspect, the optical assembly can include a support for supporting various components.

Claims

1. A method for constructing an optical assembly for use in an optical reader having a receive optical axis, comprising the steps of:

providing a support frame having a rear housing supporting a solid state imager;

disposing a first light unit and a second light unit on the support frame on either side of the receive optical axis;

providing a first field stop optically forward of the first light unit and a second field stop optically forward of the second light unit; and

providing a single piece optical element having a center aperture centered on the receive optical axis of the optical reader on said support frame so that the single piece optical element is disposed optically forward of the first field stop and the second field stop.

2. The method of claim 1, further comprising the step of molding the support frame as a single piece.

3. The method of claim 2, wherein the support frame is molded from high strength light-weight plastic.

4. The method of claim 1, further comprising the step of disposing an elongated optical element optically forward of the first field stop and the second field stop.

5. The method of claim 4, wherein the elongated optical element is semi-circular shaped.

6. The method of claim 4, wherein the elongated optical element comprises two cylindrical lens elements.

7. The method of claim 6, wherein each of the two cylindrical lens elements includes a single axis diffuser.

8. The method of claim 1, further comprising the step of disposing the first light unit and the second light unit so that each of the first light unit and the second light unit define inner and outer boundary lines, and so that said boundary lines extend without interruption through the first field stop and the second field stop, respectively.

9. The method of claim 8, wherein the first light unit and the second light unit are disposed so that each of the first light unit and the second light unit is canted.

10. The method of claim 1, wherein the solid state imager comprises an imager, an imager support, and a series of leads.

11. The method of claim 1, wherein each of the first light unit and the second light unit comprises a plurality of light emitting diodes (LEDs).

12. The method of claim 11, wherein the first light unit comprises two LEDs, and the second light unit comprises two LEDs.

13. The method of claim 1, wherein said providing step includes the steps of providing a support frame having an integrated back plate and mounting said solid state imager to said back plate.

14. The method of claim 1, wherein said providing step includes the steps of providing a support frame having an integrated back plate, said back plate defining a lead-receiving opening, and mounting a lead-equipped imager to said back plate so that at least one lead of said imager extends through said lead-receiving opening.

15. The method of claim 1, wherein said providing step includes the step of providing a support frame having an integrated back plate that includes first and second lead-receiving openings, each having a length approximately equal to a length of leads of said solid state imager to prevent at least one of sliding or twisting of leads of said solid state imager when said leads are received in said lead-receiving openings.

16. The method of claim 1, wherein said providing step includes the step of providing a support frame having an integrated back plate that includes first and second lead-receiving openings, each having sidewalls for benching leads of said solid state imager.

17. The method of claim 15, wherein said providing step includes the step of providing a support frame having an integrated back plate for receiving said solid sate imager, and having first and second lead receiving openings through which leads of said solid state imager extend, the method further including the step of biasing said solid state imager against said back plate by connecting a flex strip to said leads.

18. The method of claim 15, wherein said providing step includes the step of providing a support frame having an integrated back plate for receiving said solid sate imager, and having first and second lead receiving openings through which leads of said solid state imager extend, the method further including the step of biasing said solid state imager against said back plate using securing material selected from the group consisting of glues and tapes.

19. The method of claim 15, wherein said providing step includes the step of providing a support frame having an integrated back plate for receiving said solid sate imager, and having first and second lead receiving openings through which leads of said solid state imager extend, the method further including the step of biasing said solid state imager against said back plate by connecting a flex strip to said leads without additional securing forces supplied by adhesive material.

20. A method of constructing an optical assembly for use in an optical reader comprising the steps of:

providing a frame;

disposing a plurality of clips on said frame;

inserting a plurality of lamps into said plurality of clips;

disposing a field stop optically forward of each lamp; and

disposing an optical element defining a center aperture centered on a receive optical axis of the optical reader on said support frame so that the optical element is disposed optically forward of the first field stop and the second field stop.

21. The method of claim 20, wherein the plurality of lamps comprises a plurality of light emitting diodes (LEDs).

22. The method of claim 20, further comprising the step of disposing an imager assembly on said frame.

23. The method of claim 22, wherein the imager assembly comprises a linear array charge coupled device (CCD), and wherein said optical elements is a single piece optical element.

24. The method of claim 23, wherein the CCD has an aspect ratio of about 25:

1.

25. The method of claim 20, wherein each field stop comprises a horizontal slit having a height of between about 0.40 inches to about 0.50 inches.

26. A method of assembling an illumination package for an optical reader including the steps of:

providing a support having a forward receiving surface;

positioning a forwardly projecting light source on said support;

adjustably positioning a lens on said forward receiving surface such that said light source passes there through and is focused at a point in space;

adjusting the position of said lens on said forward receiving surface so that said light source is focused on a desired point in space; and

then securing said lens to said forward receiving surface.