Systems and Methods for Thermal Management of Lamps and Luminaires Using Led Sources

• US 20080130299A1
• Filed: 11/29/2007
• Published: 06/05/2008
• Est. Priority Date: 12/01/2006
• Status: Active Grant

• Current Assignee: ABL IP Holding LLC (Acuity Brands, Inc.)
• Original Assignee: ABL IP Holding LLC (Acuity Brands, Inc.)
• Inventors: DOROGI, Michael Jay
• Granted Patent: US 7,784,971 B2
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 23/04 the elements being switches safety devices F21V25/00
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

LED module assemblies and luminaires that reduce thermal issues associated with LED lamp energy dissipation are disclosed. In one embodiment, an optimized conduction path from the LED to the exterior of the luminaire is created through the use of heat pipes integrated into the LED module assembly and luminaire. In this embodiment, a significant reduction in thermal transfer to the interior of the enclosure may be implemented, while allowing maximum energy dissipation from the LEDs.

Claims

1. An LED module assembly comprising:

a thermal assembly comprising a heat pipe and contact pad coupled to an exterior surface of the heat pipe;

at least one light emitting diode coupled to the contact pad;

a heat pipe mating surface connected to an end of the thermal assembly; and

an LED driver connected in close proximity to the thermal assembly.

2. The LED module assembly of claim 1, wherein the LED driver is a PWM dimming driver.

3. The LED module assembly of claim 1, wherein the at least one light emitting diode comprises one of an individual LED, an LED chip, or an LED die.

4. The LED module assembly of claim 1, wherein the at least one light emitting diode is coupled to the contact pad by mounting the at least one light emitting diode to a printed circuit board that is attached to the contact pad.

5. The LED module assembly of claim 1, wherein the at least one light emitting diode is mounted directly to the surface of the contact pad.

6. The LED module assembly of claim 5, wherein the contact pad has at least one groove located on a surface of the contact pad substantially parallel and opposite at least one electrical contact area on a surface of the at least one light emitting diode to prevent contact between the electrical contact area and the contact pad.

7. The LED module assembly of claim 1, further comprising a material with a low thermal conductivity substantially surrounding the interface between the at least one light emitting diode and the contact pad.

8. The LED module assembly of claim 7, wherein the material with a low thermal conductivity is a thermally insulating material.

9. The LED module assembly of claim 1, wherein the contact pad is dimensioned to have a substantially similar surface area as one of the at least one light emitting diode.

10. The LED module assembly of claim 1, wherein the contact pad is dimensioned to accommodate a plurality of light emitting diodes.

11. An LED module assembly comprising:

a thermal assembly comprising a heat pipe and a contact pad coupled to an exterior surface of the heat pipe;

at least one light emitting diode coupled directly to the contact pad;

a groove formed on a surface of the contact pad substantially parallel and opposite electrical contact area on a surface of the light emitting diode to prevent contact between the electrical contact area and the contact pad;

a printed circuit board coupled to the front of the at least one light emitting diode; and

a heat pipe mating surface connected to an end of the thermal assembly.

12. The LED module assembly of claim 11, wherein the light emitting diode comprises an individual LED, an LED chip, or an LED die.

13. The LED module assembly of claim 11, further comprising a material with a low thermal conductivity substantially surrounding the interface between the light emitting diode, the printed circuit board, and the contact pad.

14. The LED module assembly of claim 13, wherein the material with a low thermal conductivity is a thermally insulating material.

15. The LED module assembly of claim 11, wherein the contact pad and one of the at least one light emitting diode are dimensioned to have substantially similar surface areas.

16. The LED module assembly of claim 11, wherein the contact pad is dimensioned to accommodate a plurality of light emitting diodes.

17. The LED module assembly of claim 11, further comprising an LED driver connected in close proximity to the thermal assembly.

18. The LED module assembly of claim 17, wherein the LED driver is a PWM dimming driver.

19. An apparatus comprising:

an LED module assembly comprising;

a thermal assembly comprising a heat pipe and contact pad coupled to an exterior surface of the heat pipe;

at least one light emitting diode coupled to the contact pad;

a heat pipe mating surface connected to an end of the thermal assembly; and

an LED driver connected in close proximity to the thermal assembly;

a luminaire housing;

an external heat sink adjacent an end of the housing;

a thermal junction between the heat pipe mating surface and an interior surface of the housing near the end of the housing; and

a member attached to the housing that adjusts a position of the LED module assembly with respect to the housing and configured to apply mechanical force to the thermal junction when the heat pipe mating surface contacts the interior surface of the housing.

20. The apparatus of claim 19, wherein the LED driver is a PWM dimming driver.

21. The apparatus of claim 19, wherein the light emitting diode comprises an individual LED, an LED chip, or an LED die mounted to a printed circuit board that is attached to the contact pad.

22. The apparatus of claim 19, wherein the member is a spring loaded latch for engaging and disengaging the LED module assembly at the thermal junction.

23. The apparatus of claim 19, wherein the thermal assembly comprises a heat pipe and contact pad integrated as single structure.

25. The apparatus of claim 23, wherein the member is a spring loaded latch for engaging and disengaging the LED module assembly at the thermal junction.

24. An apparatus comprising:

an LED module assembly comprising;

a thermal assembly comprising a heat pipe and contact pad coupled to an exterior surface of the heat pipe;

at least one light emitting diode coupled directly to the contact pad;

a groove formed on a surface of the contact pad substantially parallel and opposite an electrical contact area on a surface of the light emitting diode to prevent contact between the electrical contact area and the contact pad;

a printed circuit board coupled to the front of the at least one light emitting diode; and

a heat pipe mating surface connected to an end of the thermal assembly;

a luminaire housing;

an external heat sink adjacent an end of the housing;

a thermal junction between the heat pipe mating surface and an interior surface of the housing near the end of the housing; and

a member attached to the housing that adjusts a position of the LED module assembly with respect to the housing and configured to apply mechanical force to the thermal junction when the heat pipe mating surface contacts the interior surface of the housing.