Semiconductor device and method for manufacturing same
First Claim
1. A semiconductor device with one of plural active elements and plural passive elements formed on one semiconductor substrate, the semiconductor device comprising:
- plural field areas on the semiconductor substrate; and
an insulation separation trench that surrounds the plural field areas,wherein the insulation separation trench penetrates the semiconductor substrate for dividing the semiconductor substrate into the plural field areas,each of the field areas includes one of the plural active elements and plural passive elements, andat least two elements among the plural active elements and the plural passive elements have a pair of power electrodes for power supply disposed on both sides of the semiconductor substrate.
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Accused Products
Abstract
A semiconductor device having plural active and passive elements on one semiconductor substrate is manufactured in the following cost effective manner even when the active and passive elements include double sided electrode elements. When the semiconductor substrate is divided into plural field areas, an insulation separation trench that penetrates the semiconductor substrate surrounds each of the field areas, and each of the either of the plural active elements or the plural passive elements. Further, each of the plural elements has a pair of power electrodes for power supply respectively disposed on each of both sides of the semiconductor substrate to serve as the double sided electrode elements.
41 Citations
23 Claims
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1. A semiconductor device with one of plural active elements and plural passive elements formed on one semiconductor substrate, the semiconductor device comprising:
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plural field areas on the semiconductor substrate; and an insulation separation trench that surrounds the plural field areas, wherein the insulation separation trench penetrates the semiconductor substrate for dividing the semiconductor substrate into the plural field areas, each of the field areas includes one of the plural active elements and plural passive elements, and at least two elements among the plural active elements and the plural passive elements have a pair of power electrodes for power supply disposed on both sides of the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing a semiconductor device with a semiconductor substrate including plural field areas separated by a surrounding substrate penetrating insulation separation trench, wherein the semiconductor substrate has formation of plural active elements or plural passive elements made of the semiconductor substrate, wherein the plural active elements and the plural passive elements are distributed in different field areas, wherein at least two elements among the plural active elements and the plural passive elements have a pair of power electrode for power supply distributed on both sides of the semiconductor substrate, the method of manufacturing the semiconductor device as a double sided electrode element comprising:
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preparing an element formation semiconductor substrate having a predetermined thickness; forming a yet-penetrating insulation separation trench from a first side surface of the element formation semiconductor substrate by a predetermined depth for surrounding each of the plural field areas; polishing the element formation substrate from a second side to expose a tip of the yet-penetrating insulation separation trench for forming the element formation substrate as the semiconductor substrate and for forming the yet-penetrating insulation separation trench as the insulation separation trench; forming either of the plural active elements or the plural passive elements on the first side of the element formation semiconductor substrate; and forming either of the plural active elements or the plural passive elements on the second side of the semiconductor substrate after the polishing the element formation substrate. - View Dependent Claims (19, 20, 21, 22, 23)
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Specification