Light emitting diode package and method of manufacturing the same

• US 20080142822A1
• Filed: 07/13/2007
• Published: 06/19/2008
• Est. Priority Date: 12/13/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Jong Myeon, Choi, Chang Hwan, Moon, Won Ha, Kim, Hyun Jun, Kim, Dong Woohn
• Granted Patent: US 8,368,097 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.

Claims

1. A light emitting diode (LED) package comprising:

a frame having a concave portion formed in the center thereof;

one or more LED chips mounted on the bottom surface of the concave portion; and

a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.

2. The LED package according to claim 1,

wherein the side of the concave portion is formed in a tapered shape expanding upward.

3. The LED package according to claim 1,

wherein the frame has an upper opening formed in a circular shape, and the lower circumference of the lens is formed in a shape corresponding to the shape of the upper opening of the frame.

4. The LED package according to claim 1,

wherein the lens is formed of a transparent resin material.

5. The LED package according to claim 1,

wherein the prismatic irregularities form concentric circles from the center of the upper surface of the lens toward the edge.

6. The LED package according to claim 5,

wherein the concentric circles are spaced in even intervals.

7. An LED package comprising:

a frame having a concave portion formed in the center thereof;

one or more LED chips mounted on the bottom surface of the concave portion; and

a lens filled in the concave portion, the lens having an upper surface formed of a Fresnel lens surface.

8. The LED package according to claim 7,

wherein the side of the concave portion is formed in a tapered shape expanding upward.

9. The LED package according to claim 7,

wherein the frame has an upper opening formed in a circular shape, and the lower circumference of the lens is formed in a shape corresponding to the shape of the upper opening of the frame.

10. The LED package according to claim 7,

wherein the lens is formed of a transparent resin material.

11. An LED package comprising:

a frame having a concave portion formed in the center thereof;

one or more LED chips mounted on the bottom surface of the concave portion; and

a flat dome lens filled in the concave portion.

12. The LED package according to claim 11,

wherein the side of the concave portion is formed in a tapered shape expanding upward.

13. The LED package according to claim 11,

wherein the frame has an upper opening formed in a circular shape, and the lower circumference of the lens is formed in a shape corresponding to the shape of the upper opening of the frame.

14. The LED package according to claim 11,

wherein the lens is formed of a transparent resin material.

15. A method of manufacturing an LED package comprising:

preparing one or more LED chips on a concave portion of a frame;

dispensing resin into the concave portion;

imprinting a stamp on the upper surface of the resin such that the stamp is carved; and

separating the stamp.

16. The method according to claim 15 further comprising

solidifying the resin in a state where the stamp is carved,

wherein the solidifying of the resin is performed after the imprinting of the stamp.

17. The method according to claim 15,

wherein a release agent for promoting separation is provided between the resin and the stamp.

18. The method according to claim 15,

wherein the stamp has concentrically continuous prismatic irregularities engraved on the bottom surface thereof.

19. The method according to claim 15,

wherein the stamp has a Fresnel lens surface engraved on the bottom surface thereof.

20. The method according to claim 15,

wherein the stamp has the shape of a flat dome lens engraved on the bottom surface thereof.

21. The method according to claim 15,

wherein the resin is epoxy-, rubber-, or silicon-based transparent resin.