SHIELDED STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

• US 20080150093A1
• Filed: 12/22/2006
• Published: 06/26/2008
• Est. Priority Date: 12/22/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Lte.
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Jang, Ki Youn, Kim, YoungMin, Jeon, Hyung Jun
• Granted Patent: US 7,537,962 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06575 Auxiliary carrier between devices, the carrier having no electrical connection structure
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A shielded stacked integrated circuit package system is provided including forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Claims

1. A shielded stacked integrated circuit package system comprising:

forming a first integrated circuit structure having a first substrate and a first integrated circuit die;

mounting a shield over the first substrate and the first integrated circuit die;

mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and

forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

2. The system as claimed in claim 1 further comprising forming the shield includes forming a horizontal portion having a first vertical portion extended below therefrom and a second vertical portion extended above therefrom.

3. The system as claimed in claim 1 further comprising forming the shield includes forming a horizontal portion having a first vertical portion extended below therefrom and a recess therein.

4. The system as claimed in claim 1 further comprising:

forming the shield includes forming a horizontal portion having a first vertical portion extended below therefrom and a recess therein; and

wherein mounting the second integrated circuit structure includes;

placing the second integrated circuit die partially in the recess.

5. The system as claimed in claim 1 further comprising:

forming the shield includes forming a horizontal portion having a first vertical portion extended below therefrom and a second vertical portion extended above therefrom; and

wherein mounting the second integrated circuit structure includes;

mounting the second substrate on the second vertical portion with the second integrated circuit die facing the first integrated circuit die.

6. A shielded stacked integrated circuit package system comprising:

forming a first integrated circuit structure having a first substrate and a first integrated circuit die attached on the first substrate;

mounting a shield on the first substrate with an adhesive and over the first integrated circuit die;

mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield, the second integrated circuit die attached on the second substrate; and

forming a package encapsulation for covering the first integrated circuit die, the shield, the second integrated circuit structure, and a first device side of the first substrate.

7. The system as claimed in claim 6 further comprising attaching an external interconnect with a first non-device side of the first substrate.

8. The system as claimed in claim 6 further comprising connecting an external interconnect with a first non-device side of the first substrate and the shield for grounding.

9. The system as claimed in claim 6 further comprising forming the shield includes:

forming a first portion having a first vertical portion;

forming a second portion having a second vertical portion; and

attaching the first portion and the second portion.

10. The system as claimed in claim 6 further comprising forming the shield having a hole.

11. A shielded stacked integrated circuit package system comprising:

a first integrated circuit structure having a first substrate and a first integrated circuit die;

a shield over the first substrate and the first integrated circuit die;

a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield;

an internal interconnect between the first substrate and the second substrate; and

a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

12. The system as claimed in claim 11 wherein the shield includes a horizontal portion having a first vertical portion extended below therefrom and a second vertical portion extended above therefrom.

13. The system as claimed in claim 11 wherein the shield includes a horizontal portion having a first vertical portion extended below therefrom and a recess therein.

14. The system as claimed in claim 11 wherein the shield includes a horizontal portion having a first vertical portion extended below therefrom and a recess therein with the second integrated circuit die partially in the recess.

15. The system as claimed in claim 11 wherein the shield includes a horizontal portion having a first vertical portion extended below therefrom and a second vertical portion extended above therefrom with the second substrate on the second vertical portion with the second integrated circuit die facing the first integrated circuit die.

16. The system as claimed in claim 11 wherein:

the first integrated circuit structure has the first substrate and the first integrated circuit die attached with the first substrate with a first adhesive;

the shield is attached to the first substrate with a second adhesive and over the first integrated circuit die;

the second integrated circuit structure has the second substrate and the second integrated circuit die over the shield with the second integrated circuit die attached to the second substrate with the first adhesive;

the internal interconnect is a bond wire between the first substrate and the second substrate; and

the package encapsulation is a cover for the first integrated circuit die, the shield, the second integrated circuit structure, and a first device side of the first substrate.

17. The system as claimed in claim 16 further comprising an external interconnect attached to a first non-device side of the first substrate.

18. The system as claimed in claim 16 further comprising an external interconnect connected with a first non-device side of the first substrate and the shield for grounding.

19. The system as claimed in claim 16 wherein the shield includes:

a first portion having a first vertical portion; and

a second portion, having a second vertical portion, is attached with the first portion.

20. The system as claimed in claim 16 wherein the shield includes a hole.