METHODS OF CONNECTING AN ANTENNA TO A TRANSPONDER CHIP

• US 20080155822A1
• Filed: 07/05/2007
• Published: 07/03/2008
• Est. Priority Date: 01/01/2007
• Status: Active Grant

• Current Assignee: Assa Abloy AB, HID Global GmbH (Assa Abloy AB), Féinics AmaTech Teoranta (Paragon Group Limited)
• Original Assignee: ADVANCED MICROELECTRONIC AND AUTOMATION TECHNOLOGY LTD.
• Inventors: FINN, David
• Granted Patent: US 7,581,308 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/78744 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding

Abstract

A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted into the recess from the same side as the antenna. The end portions may then be repositioned to be over corresponding terminals of the chip, for bonding thereto. The recess may be substantially larger than the chip, so that the chip and/or the substrate may be moved from side-to-side in the recess for positioning the terminals under the end portions, for bonding thereto. Insulation may be removed from the end portions prior to mounting the chip in the recess, to enhance subsequent bonding.

Claims

1. Method of connecting an antenna wire to a transponder chip comprising:

providing a recess in a surface of a substrate;

mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;

characterized by;

the end portions of the antenna wire are spaced a distance apart from one another, wherein the distance is greater than a width dimension of the transponder chip, so that the transponder chip may be disposed in the recess after the antenna wire is mounted to the surface of the substrate; and

repositioning at least one of the end portions so that the two end portions are located directly over corresponding two terminals of the transponder chip.

2. The method of claim 1, further comprising:

interconnecting the two end portions of the antenna wire to the corresponding two terminals of the transponder chip.

3. The method of claim 1, further comprising:

repositioning both of the two end portions of the wire to be over the corresponding two terminals of the transponder chip.

4. The method of claim 1, further comprising:

imparting a first relative motion between the chip and the substrate so that the first terminal of the chip is positioned under the first end portion of the wire, and bonding the first end portion of the wire to the first terminal of the chip; and

imparting a second relative motion between the chip and the substrate so that the second terminal of the chip is positioned under the second end portion of the wire, and bonding the second end portion of the wire to the second terminal of the chip.

5. The method of claim 4, further comprising:

imparting a third relative motion between the chip and the substrate to center the chip in the recess.

6. The method of claim 4, wherein:

the first and second relative motions are imparted by moving the chip relative to a stationary substrate.

7. The method of claim 4, wherein:

the first and second relative motions are imparted by moving the substrate relative to a stationary chip.

8. The method of claim 4, further comprising:

removing insulation from the wire prior to bonding.

9. The method of claim 1, wherein:

the chip has a width dimension; and

the recess has a width dimension which is significantly greater than the width dimension of the chip 308, including at least 20% greater, at least 25% greater, at least 30% greater, at least 40% greater, at least 50% greater, at least 60% greater.