Stress Mitigation in Packaged Microchips

• US 20080157298A1
• Filed: 06/28/2007
• Published: 07/03/2008
• Est. Priority Date: 06/29/2006
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Zhang, Xin, Kuan, Nelson, Chau, Kevin H.L., Paydenkar, Chetan, Farrell, Peter, Spooner, Timothy, Judy, Michael
• Granted Patent: US 8,344,487 B2
• Time in Patent Office: Days
• US Class Current: 257/669
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15747 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Claims

1. A package apparatus comprising:

a base; and

a lid coupled with the base forming a leadframe package,

the leadframe package forming a first exterior surface and a second exterior surface, the first exterior surface forming a first contact pattern, the second exterior surface forming a second contact pattern, the first exterior surface being in a plane that intersects the plane of the second exterior surface, the first and second contact patterns being substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

2. The apparatus as defined by claim 1 wherein the base and lid form a premolded leadframe package.

3. The apparatus as defined by claim 2 wherein the base and lid form a chamber for receiving an integrated circuit.

4. The apparatus as defined by claim 3 further comprising an integrated circuit mounted within the chamber, the integrated circuit being substantially identically electrically connected with the first contact pattern and the second contact pattern.

5. The apparatus as defined by claim 1 wherein the lid and base comprise a moldable material, the first contact pattern comprising a first plurality of contacts substantially embedded within the moldable material of at least one of the lid and base, the second contact pattern comprising a second plurality of contacts substantially embedded within the moldable material of at least one of the lid and base.

6. The apparatus as defined by claim 1 wherein the lid comprises a lid leadframe, the base comprising a base leadframe, the lid leadframe being in electrical contact with the base leadframe.

7. The apparatus as defined by claim 1 wherein the first exterior surface is substantially orthogonal to the second exterior surface.

8. The apparatus as defined by claim 1 wherein the first exterior surface is adjacent to the second exterior surface.

9. An apparatus comprising:

a base; and

a lid coupled with the base to form a package having at least one leadframe,

the base and lid forming a plurality of exterior surfaces, the at least one leadframe forming a first contact means on a first exterior surface, the at least one leadframe forming a second contact means on a second exterior surface, the first exterior surface being orthogonal to the second exterior surface, the first contact means and second contact means being substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

10. The apparatus as defined by claim 9 wherein the first contact means comprises a plurality of contacts.

11. The apparatus as defined by claim 9 further comprising an electrical interconnect apparatus coupled with no more than one of the first contact means or the second contact means.

12. The apparatus as defined by claim 9 wherein the package is a premolded leadframe package.

13. The apparatus as defined by claim 12 wherein the base and lid form a chamber for receiving an integrated circuit.

14. The apparatus as defined by claim 13 further comprising an integrated circuit mounted within the chamber.

15. The apparatus as defined by claim 9 wherein the lid comprises a leadframe encapsulated in moldable material.

16. A method of forming a packaged integrated circuit, the method comprising:

forming at least one leadframe to have a first plurality of contacts and a second plurality of contacts;

encapsulating a portion of the at least one leadframe within a moldable material to form a base and a lid;

securing an integrated circuit to the base after encapsulating;

electrically connecting the integrated circuit with the a least one leadframe, the integrated circuit substantially identically electrically connecting with the first plurality of contacts and the second plurality of contacts; and

connecting the base to the lid to form a premolded package having first and second orthogonal, exterior surfaces, the first plurality of contacts being on the first exterior surface, the second plurality of contacts being on the second exterior surface.

17. The method as defined by claim 16 wherein encapsulating comprises:

encapsulating a first leadframe with the moldable material to form the lid; and

encapsulating a second leadframe with the moldable material to form the base.

18. The method as defined by claim 17 wherein the first leadframe is in electrical contact with the second leadframe after connecting the base to the lid.

19. The method as defined by claim 16 wherein the integrated circuit comprises a MEMS device.

20. The method as defined by claim 16 wherein encapsulating comprises embedding the first plurality of contacts within the moldable material.

21. A package apparatus comprising:

a base; and

a lid coupled with the base forming a package,

the package forming a first exterior surface and a second exterior surface, the first exterior surface forming a first contact pattern, the second exterior surface forming a second contact pattern, the first exterior surface being in a plane that intersects the plane of the second exterior surface, the first and second contact patterns being substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.