Double-sided touch sensitive panel and flex circuit bonding
First Claim
1. A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
- applying a bonding head to a first side of the substrate to create a first bond between a first flex circuit portion and conductors on a first attachment area of the first side, the bonding head applying heat and pressure directly to the first flex circuit portion; and
applying a cooling head to a second side of the substrate to maintain a previously formed second bond between a second flex circuit portion and conductors on a second attachment area of the second side;
wherein the first attachment area and the second attachment area are on directly opposing sides of the substrate.
4 Assignments
0 Petitions
Accused Products
Abstract
A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.
341 Citations
54 Claims
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1. A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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applying a bonding head to a first side of the substrate to create a first bond between a first flex circuit portion and conductors on a first attachment area of the first side, the bonding head applying heat and pressure directly to the first flex circuit portion; and applying a cooling head to a second side of the substrate to maintain a previously formed second bond between a second flex circuit portion and conductors on a second attachment area of the second side; wherein the first attachment area and the second attachment area are on directly opposing sides of the substrate. - View Dependent Claims (2, 3)
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4. A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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forming a first attachment area on a first side of the substrate; forming a second attachment area on a second side of the substrate, the first and second attachment areas directly opposing each other; applying a bonding head to the first attachment area of the first side to create a first bond between a first flex circuit portion and the first attachment area of the first side, the bonding head applying heat and pressure directly to the first flex circuit portion; and applying a cooling head to the second attachment area of the second side to maintain a previously formed second bond between a second flex circuit portion and the second attachment area of the second side. - View Dependent Claims (5, 6)
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7. A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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applying a first bonding head to a first side of the substrate to create a first bond between a first flex circuit portion and conductors in a first area of a first attachment area of the first side, the first bonding head shaped for applying heat and pressure to the first area; and applying a second bonding head to a second side of the substrate to create a second bond between a second flex circuit portion and conductors in a second area of a second attachment area of the second side, the second bonding head shaped for applying heat and pressure to the second area; wherein the first attachment area and the second attachment area are on directly opposing sides of the substrate. - View Dependent Claims (8)
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9. A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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forming a first attachment area on a first side of the substrate having conductors in a first area and forming a first flex circuit portion corresponding to the conductors on the first attachment area; forming a second attachment area on a second side of the substrate having conductors in a second area and forming a second flex circuit portion corresponding to the conductors on the second attachment area, the first and second attachment areas directly opposing each other but the first and second areas on non-opposing sides; shaping a first bonding head to apply heat and pressure to the first area; shaping a second bonding head to apply heat and pressure to the second area; applying the first bonding head to the first side of the substrate to create a first bond between the first flex circuit portion and the conductors in the first area on the first attachment area of the first side; and applying the second bonding head to the second side of the substrate to create a second bond between the second flex circuit portion and the conductors in the second area on the second attachment area of the second side. - View Dependent Claims (10)
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11. A method for bonding a flex circuit to a substrate, the flex circuit having a ribbon area and an attachment area, the method comprising:
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applying coverlay to cover traces on the ribbon area and angled traces on the attachment area; forming a spacer at a distal end of the attachment area, the spacer and coverlay on non-opposing sides of the flex circuit; and applying a bonding head to apply heat and pressure to the attachment area to bond the attachment area to the substrate. - View Dependent Claims (12)
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13. A method for bonding a flex circuit to a substrate, the flex circuit have a ribbon area and an attachment area, the method comprising:
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sealing angled traces on the attachment area; using a spacer at a distal end of the attachment area to force the distal end of the attachment area down to the substrate, the spacer and coverlay on non-opposing sides of the flex circuit; and applying a bonding head to apply heat and pressure to the attachment area to bond the attachment area to the substrate.
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14. A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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a bonding head for creating a first bond between a first flex circuit portion and conductors on a first attachment area of a first side of the substrate, the bonding head configured for applying heat and pressure directly to the first flex circuit portion; and a cooling head configured in a directly opposing orientation as compared to the bonding head for maintaining a previously formed second bond between a second flex circuit portion and conductors on a second attachment area of a second side of the substrate; wherein the first attachment area and the second attachment area are on directly opposing sides of the substrate. - View Dependent Claims (15, 16)
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17. A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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a substrate having a first attachment area on a first side and a second attachment area on a second side, the first and second attachment areas directly opposing each other; a bonding head for creating a first bond between a first flex circuit portion and the first attachment area of the first side, the bonding head applying heat and pressure directly to the first flex circuit portion; and a cooling head for maintaining a previously formed second bond between a second flex circuit portion and the second attachment area of the second side. - View Dependent Claims (18, 19)
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20. A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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a first bonding head for creating a first bond between a first flex circuit portion and conductors in a first area of a first attachment area of a first side of the substrate, the first bonding head shaped for applying heat and pressure to the first area; and a second bonding for creating a second bond between a second flex circuit portion and conductors in a second area of a second attachment area of a second side of the substrate, the second bonding head shaped for applying heat and pressure to the second area; wherein the first attachment area and the second attachment area are on directly opposing sides of the substrate. - View Dependent Claims (21)
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22. A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:
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a substrate having a first attachment area on a first side and a second attachment area on a second side, the first attachment area having conductors in a first area and the second attachment area having conductors in a second area, the first and second attachment areas directly opposing each other but the first and second areas on non-opposing sides of the substrate; a first flex circuit portion configured to correspond with the conductors on the first attachment area; a second flex circuit portion configured to correspond with the conductors on the second attachment area; a first bonding head shaped to apply heat and pressure to the first area to create a first bond between the first flex circuit portion and the conductors in the first area on the first attachment area of the first side; and a second bonding head shaped to apply heat and pressure to the second area to create a second bond between the second flex circuit portion and the conductors in the second area on the second attachment area of the second side. - View Dependent Claims (23)
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24. A flex circuit for bonding to a substrate, comprising:
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a ribbon area; an attachment area connected to the ribbon area; coverlay applied over traces on the ribbon area and angled traces on the attachment area; a spacer formed at a distal end of the attachment area, the spacer and coverlay on non-opposing sides of the flex circuit and configured for enabling a bonding head to apply heat and pressure to the attachment area to bond the attachment area to the substrate. - View Dependent Claims (25, 26, 27, 28, 29)
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30. A flex circuit for bonding to a substrate, comprising:
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a ribbon area; an attachment area connected to the ribbon area; coverlay applied over traces on the ribbon area and angled traces on the attachment area; a spacer formed at a distal end of the attachment area to force the distal end of the attachment area down to the substrate, the spacer and coverlay on non-opposing sides of the flex circuit and configured for enabling a bonding head to apply heat and pressure to the attachment area to bond the attachment area to the substrate. - View Dependent Claims (31, 32, 33, 34)
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35. A capacitive touch sensor panel, comprising:
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a substrate formed from a dielectric material; a first set of non-overlapping traces of conductive material formed on a first side of the substrate and arranged along a first dimension of a two-dimensional coordinate system; and a second set of non-overlapping traces of the conductive material formed on a second side of the substrate and arranged along a second dimension of the two-dimensional coordinate system; wherein sensors are formed at locations at which the first set of traces pass over the second set of traces while separated by the dielectric material of the substrate. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43)
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44. A mobile telephone having a capacitive touch sensor panel, the capacitive touch sensor panel comprising:
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a substrate formed from a dielectric material; a first set of non-overlapping traces of conductive material formed on a first side of the substrate and arranged along a first dimension of a two-dimensional coordinate system; and a second set of non-overlapping traces of the conductive material formed on a second side of the substrate and arranged along a second dimension of the two-dimensional coordinate system; wherein sensors are formed at locations at which the first set of traces pass over the second set of traces while separated by the dielectric material of the substrate.
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45. A digital audio player having a capacitive touch sensor panel, the capacitive touch sensor panel comprising:
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a substrate formed from a dielectric material; a first set of non-overlapping traces of conductive material formed on a first side of the substrate and arranged along a first dimension of a two-dimensional coordinate system; and a second set of non-overlapping traces of the conductive material formed on a second side of the substrate and arranged along a second dimension of the two-dimensional coordinate system; wherein sensors are formed at locations at which the first set of traces pass over the second set of traces while separated by the dielectric material of the substrate.
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46. A method for forming a capacitive touch sensor panel, comprising:
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forming and arranging a first set of non-overlapping traces of conductive material on a first side of a dielectric substrate along a first dimension of a two-dimensional coordinate system; forming and arranging a second set of non-overlapping traces of the conductive material formed on a second side of the substrate along a second dimension of the two-dimensional coordinate system; and forming sensors at locations at which the first set of traces pass over the second set of traces while separated by the dielectric material of the substrate. - View Dependent Claims (47, 48, 49, 50, 51)
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52. A method for fabricating a capacitive touch sensor panel, comprising:
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supporting a dielectric substrate on one or more conveying members of fabrication machinery; depositing a layer of conductive material on a first side of a dielectric substrate and etching the conductive material to form a first set of non-overlapping traces along a first dimension of a two-dimensional coordinate system; depositing a protective coating of photoresist over the first set of traces on the first side of the substrate; reversing an orientation of the substrate on the one or more conveying members of the fabrication machinery; depositing a layer of conductive material on a second side of the dielectric substrate and etching the conductive material to form a second set of non-overlapping traces along a second dimension of the two-dimensional coordinate system; and removing the photoresist on the first side of the substrate. - View Dependent Claims (53)
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54. A method for fabricating a capacitive touch sensor panel, comprising:
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sputtering conductive material on first and second sides of a dielectric substrate; applying a temporary protective film over the conductive material sputtered onto the first side of the substrate; supporting the dielectric substrate first side down on one or more conveying members of fabrication machinery; depositing a protective coating of photoresist over the conductive material sputtered onto the second side of the substrate, and patterning the photoresist; supporting the dielectric substrate second side down on the one or more conveying members of the fabrication machinery; removing the temporary protective film from the first side of the substrate; depositing a protective coating of photoresist over the conductive material sputtered onto the first side of the substrate, and patterning the photoresist; etching the conductive material on the first and second sides of the substrate; and stripping off the photoresist on the first and second sides of the substrate.
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Specification