Package, in particular for MEMS devices and method of making same
First Claim
Patent Images
1. A package, comprising:
- a substrate provided with a passing opening,a MEMS device comprising an active surface wherein a sensitive portion of said MEMS device is integrated sensitive to chemical/physical variations of a fluid;
wherein said active surface of said MEMS device faces said substrate and is spaced therefrom, said sensitive portion being aligned to said passing opening; and
a protective package, which incorporates said MEMS device and said substrate, leaving at least said sensitive portion of said MEMS device exposed through said passing opening of said substrate.
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Abstract
A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.
28 Citations
48 Claims
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1. A package, comprising:
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a substrate provided with a passing opening, a MEMS device comprising an active surface wherein a sensitive portion of said MEMS device is integrated sensitive to chemical/physical variations of a fluid; wherein said active surface of said MEMS device faces said substrate and is spaced therefrom, said sensitive portion being aligned to said passing opening; and a protective package, which incorporates said MEMS device and said substrate, leaving at least said sensitive portion of said MEMS device exposed through said passing opening of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A package, comprising:
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a substrate comprising an insulating core, an integrated circuit comprising an active surface; wherein said active surface of said integrated circuit faces said substrate and is spaced therefrom; a protective package, which incorporates said integrated circuit and said substrate; and conductive vias projecting with respect to said insulating core in correspondence with an upper surface of said substrate facing said active surface of said integrated circuit, said upper surface being free from masking layers at least in correspondence with said active surface, the electric connection between said integrated circuit and said conductive vias being obtained through interposition of a layer of connection material. - View Dependent Claims (23, 24, 25)
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26. A method for protecting packages comprising a substrate provided with a passing opening, and at least one MEMS device comprising an active surface wherein a portion of said MEMS device is integrated sensitive to chemical/physical variations of a fluid, the method comprising the following steps:
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forming on said sensitive portion a protection layer which fills at least partially said passing opening, forming a protective package, which incorporates said MEMS device and said substrate, leaving said protection layer exposed, removing said protection layer so that said protective package leaves at least said sensitive portion of said MEMS device exposed, through said passing opening of said substrate. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. An electronic device, comprising:
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a substrate including a passing opening; a die coupled to the substrate, the die including an active surface and the active surface including a sensitive portion positioned adjacent the passing opening of the substrate and the die being operable to sense a physical parameter of a medium to which the sensitive portion is exposed through the passing opening; and a protective package housing the substrate and the die. - View Dependent Claims (37, 38, 39, 40, 41)
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42. An electronic system, comprising:
electronic circuitry including a sensor, the sensor including, a substrate including a passing opening; a die coupled to the substrate, the die including an active surface and the active surface including a sensitive portion positioned adjacent the passing opening of the substrate and the die being operable to sense a physical parameter of a medium to which the sensitive portion is exposed through the passing opening; and a protective package housing the substrate and the die. - View Dependent Claims (43, 44)
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45. A method of protecting packages including a substrate and a die, the die including an active surface including a sensitive portion and the method comprising:
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forming a passing opening in the substrate; forming a protection layer over the sensitive portion of the die; attaching the die to the substrate; forming a protective package to house the substrate and the die, the protective package leaving the passing opening exposed; and removing the protection layer through the passing opening. - View Dependent Claims (46, 47, 48)
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Specification