APPARATUS AND METHOD FOR HOUSING MICROMECHANICAL SYSTEMS

• US 20080164592A1
• Filed: 01/09/2008
• Published: 07/10/2008
• Est. Priority Date: 01/10/2007
• Status: Active Grant

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: BAKKE, Thor, SANDNER, Thilo
• Granted Patent: US 7,898,071 B2
• Time in Patent Office: Days
• US Class Current: 257/680
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer

Abstract

An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film layer arrangement has an opening, so that the micromechanical system adjoins the opening.

Claims

1. An apparatus for housing a micromechanical or a micro-optoelectrical system, comprising:

a substrate with a surface on which the micromechanical system is formed;

a transparent cover; and

a dry film layer arrangement between the surface of the substrate and the transparent cover,

wherein the dry film layer arrangement comprises an opening, so that the micromechanical system adjoins the opening.

2. The apparatus according to claim 1, wherein the transparent cover comprises an optical material transparent in a predetermined wavelength range.

3. The apparatus according to claim 1, wherein the transparent cover comprises glass, quartz, silicon, germanium, calcium fluoride, or an optical polymer.

4. The apparatus according to claim 1, wherein an optical device is attached at the transparent cover.

5. The apparatus according to claim 4, wherein the additional optical device comprises a microlens, microlens array, a zoning plate, a microprism, a transmission grating, a beam splitter, or mirroring.

6. The apparatus according to claim 1, wherein the micromechanical or micro-optoelectrical system comprises a CCD image sensor, a CCD array, a bolometer, a bolometer array, a thermopile, a thermopile array, a pyroelectrical sensor, a CMOS image sensor, or a CMOS/CCD array.

7. The apparatus according to claim 1, wherein the transparent cover further comprises a dereflection, or a spectral or/and polarization filter coating.

8. The apparatus according to claim 1, wherein the transparent cover comprises an opening for connecting contacts in lateral spacing to the opening of the dry film layer arrangement, and the connecting contacts are capable of being electrically coupled to the micromechanical system.

9. The apparatus according to claim 1, wherein the dry film layer arrangement comprises polymer material.

10. The apparatus according to claim 1, wherein the dry film layer arrangement comprises a layer sequence of several overlying dry film layers.

11. The apparatus according to claim 1, wherein the dry film layer arrangement comprises a layer thickness of more than 100 μ

m.

12. The apparatus according to claim 1, wherein the substrate comprises a layer in which the micromechanical system is formed and a carrier substrate, between which an adhesive layer is arranged.

13. The apparatus according to claim 1, wherein the substrate is bonded to the dry film layer arrangement by means of a thermal pressure bond.

14. The apparatus according to claim 1, wherein the substrate comprises a recess into which a part of the micromechanical system expands or can move.

15. The apparatus according to claim 1, further comprising an adhesion layer, wherein the adhesion layer is formed between the micromechanical system and the substrate and/or between the micromechanical system and the dry film layer arrangement, wherein the adhesion layer is formed to achieve improved adhesion and/or compensation for uneven areas of adjacent layers.

16. A method for housing a micromechanical or micro-optoelectrical system, comprising:

providing a transparent cover;

applying a dry film layer arrangement onto the transparent cover;

patterning the dry film layer arrangement to produce an opening;

bonding a surface of a substrate on which the micromechanical system is formed to the dry film layer arrangement, so that the micromechanical system adjoins the opening.

17. The method according to claim 16, further comprising dereflecting or applying a spectral or/and polarization filter coating onto the transparent cover.

18. The method according to claim 16, wherein providing the transparent cover comprises forming openings, wherein the openings are formed such that electrically contacting is enabled at connecting contacts of the micromechanical system.

19. The method according to claim 16, wherein applying the dry film layer arrangement includes applying a layer sequence of several dry film layers.

20. The method according to claim 16, further including gluing the micromechanical system onto the substrate.

21. The method according to claim 16, further including applying a spacer layer between the carrier substrate and the micromechanical system, so that the micromechanical system is separated a predetermined distance from the carrier substrate by the spacer layer.

22. A system with an apparatus for housing a micromechanical or a micro-optoelectrical system, the apparatus comprising:

a substrate with a surface on which the micromechanical system is formed;

a transparent cover; and

a dry film layer arrangement between the surface of the substrate and the transparent cover,

wherein the dry film layer arrangement comprises an opening, so that the micromechanical system adjoins the opening,

wherein the system is a laser-scanning projection display, a barcode reading device, an image pickup, a retina projection display, an optical detector or a spatial light modulator.