Forming method of liquid crystal layer using ink jet system

• US 20080166829A1
• Filed: 01/08/2008
• Published: 07/10/2008
• Est. Priority Date: 05/29/2001
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Hwang, Yong-Sup, Lee, Jae-Kyun, Chae, Goe-Sung
• Granted Patent: US 7,548,284 B2
• Time in Patent Office: Days
• US Class Current: 438/30
• CPC Class Codes: G02F 1/13458 Terminal pads
• CPC Class Codes: G02F 1/1362 Active matrix addressed cells G02F1/134336, G02F1/134363 take precedence
• CPC Class Codes: G02F 1/136213 Storage capacitors associated with the pixel electrode

Abstract

According to an embodiment, a fabrication method includes forming a gate line disposed along a first direction and a common line parallel to the gate line on a substrate, the gate and common lines spaced apart from each other, forming a gate insulating layer on the gate and common lines, forming a semiconductor layer on the gate insulating layer, forming a source electrode and a pixel electrode of transparent conductive material, the pixel electrode including a drain electrode portion, the drain electrode portion overlapping the semiconductor layer, forming a passivation layer including a first contact hole and an open portion, the first contact hole exposing the source electrode and the open portion exposing the pixel electrode, respectively, and forming a data line disposed along a second direction on the passivation layer, the data line connected to the source electrode through the first contact hole and crossing the gate line.

Claims

1. A fabricating method of an array substrate of a liquid crystal display device, comprising:

forming a gate line disposed along a first direction and a common line parallel to the gate line on a substrate, the gate and common lines spaced apart from each other;

forming a gate insulating layer on the gate and common lines;

forming a semiconductor layer on the gate insulating layer;

forming a source electrode and a pixel electrode of transparent conductive material, the pixel electrode including a drain electrode portion, the drain electrode portion overlapping the semiconductor layer, the source electrode spaced apart from the drain electrode portion;

forming a passivation layer including a first contact hole and an open portion, the first contact hole exposing the source electrode and the open portion exposing the pixel electrode, respectively; and

forming a data line disposed along a second direction on the passivation layer, the data line connected to the source electrode through the first contact hole and crossing the gate line.

2. The method according to claim 1, wherein forming the semiconductor layer is performed by subsequently forming an active layer of amorphous silicon, an ohmic contact layer of doped amorphous silicon and a metal layer of titanium or chromium, and a portion of the active layer between the source electrode and the drain electrode portion is exposed.

3. The method according to claim 1, further comprising forming a gate link and forming a gate pad at an end portion of the gate line,

the gate link made of the same material as the data line and overlapping the gate line and the gate pad,

the gate line connected to the gate link through a second contact hole in the gate insulating and passivation layers,

the gate pad made of the same material as the pixel electrode and connected to the gate link through a third contact hole in the passivation layer.

4. The method according to claim 3, wherein the gate link is wider than the gate pad.

5. The method according to claim 1, further comprising forming a data pad at an end portion of the data line, the data pad overlapping the data line, made of the same material as the pixel electrode and connected to the data line through a fourth contact hole.

6. The method according to claim 5, wherein the overlapped data line is wider than the data pad.

7. The method according to claim 1, wherein the pixel electrode overlaps the gate line.

8. The method according to claim 1, wherein the first contact hole is disposed under the data line.

9. The method according to claim 1, wherein the transparent material is indium tin oxide.

10. The method according to claim 1, wherein the passivation layer is made of acrylate resin.

11. A fabricating method of an array substrate of a liquid crystal display device, comprising:

forming a common electrode on a substrate,

forming a gate line disposed along a first direction and a common line parallel to the gate line, the common line spaced apart from the gate line and contacting the common electrode;

forming a gate insulating layer on the gate and common lines;

forming a semiconductor layer on the gate insulating layer;

forming a source electrode and a pixel electrode of transparent conductive material, the pixel electrode including a drain electrode portion, the drain electrode portion overlapping the semiconductor layer, the source electrode spaced apart from the drain electrode portion;

forming a passivation layer including a first contact hole and an open portion, the first contact hole exposing the source electrode and the open portion exposing the pixel electrode, respectively; and

forming a data line disposed along a second direction on the passivation layer, the data line connected to the source electrode through the first contact hole and crossing the gate line.