Interconnect architecture for disc drive array

• US 20080174906A1
• Filed: 01/23/2007
• Published: 07/24/2008
• Est. Priority Date: 01/23/2007
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Kalderon, Steven A., Xue, Song Sheng, Amin, Nurul, Ryan, Patrick Joseph, White, Andrew D., Hipwell, Roger L., Johnston, Alan B., Bonin, Wayne A., Pendray, John R., Berkowitz, Jeffery Kenneth, Leuthold, Hans L., Ver Meer, Bradley J.
• Granted Patent: US 7,826,171 B2
• Time in Patent Office: Days
• US Class Current: 360/97.02
• CPC Class Codes: G11B 19/2009 Turntables, hubs and motors for disk drives; Mounting of motors in the drive means for clamping of disk to turntable G11B17/022 and subgroups
• CPC Class Codes: G11B 25/043 using rotating discs
• CPC Class Codes: G11B 33/126 Arrangements for providing electrical connections, e.g. connectors, cables, switches

Abstract

In general, the invention is directed to techniques for integrated interconnects with a set of disc drives. The interconnects allow for a set of disc drives to be positioned in an array; for example, as set of disc drives may be stacked to communicate with a device through a single interface of the device. The interconnects may be formed as vias within the housing of the disc drives. Vias may produced using MEMS techniques, e.g., electroplating, as part of the manufacturing processes of the disc drive itself.

Claims

1. A first disc drive comprising:

a housing;

an interface for connecting a second disc drive on a first side of the housing; and

a set of vias integrated with the housing, wherein the vias extend through the housing to connect the interface to a component located on a second side of the housing.

2. The first disc drive of claim 1, wherein the first side is substantially parallel to the second side.

3. The first disc drive of claim 1, further composing a control circuitry integrated within the housing, wherein the control circuitry controls read and write operations in the first disc drive.

4. The first disc drive of claim 3, wherein the control circuitry further controls read and write operations in the second disc drive.

5. The first disc drive of claim 3, wherein the control circuitry is an integrated circuit.

6. The first disc drive of claim 1, wherein the housing includes a base and a cover, wherein one or more vias of the set of vias extend though both the base and the cover.

7. The first disc drive of claim 1, further comprising an environmental control module, wherein one or more via of the set of vias are electrically coupled to the environmental control module of the first disc drive.

8. The first disc drive of claim 1, wherein the component is a printed circuit board.

9. An assembly comprising:

an electronic device including a first interface;

a first disc drive connected to the electronic device via the first interface, wherein the first disc drive includes;

a housing including a set of vias integrated within the housing, and

a second interface; and

a second disc drive connected to the second interface, wherein communication signals between the second disc drive and the electronic device traverse one or more via of the set of vias.

10. The assembly of claim 9, further comprising a bonding pad, wherein the bonding pad secures the first disc drive to the second disc drive.

11. The assembly of claim 9, wherein the set of vias includes a subset of vias that couple a first environmental control module in the first disc drive to a second environmental control module in the second disc drive.

12. The assembly of claim 11, wherein the environmental control module includes a resistive heating element.

13. The assembly of claim 9, wherein the set of vias includes a subset of vias that couple a first set of disc actuation electrodes in the first disc drive to a second set of disc actuation electrodes in the second disc drive.

14. The assembly of claim 9, wherein electronic device includes a printed circuit board forming the first interface.

15. The assembly of claim 9, wherein electronic device includes a integrated circuit forming the first interface.

16. The assembly of claim 9, wherein the first disc drive includes control circuitry that controls read and write operations of the second disc drive.

17. The assembly of claim 16, wherein the first disc drive includes a servo controller for the second disc drive.

18. A disc drive comprising:

a housing fabricated using MEMS manufacturing processes;

an interface for connecting an electronic device on a first side of the housing; and

a set of vias integrated with the housing, wherein the vias extend through the housing to connect the interface to a component located on a second side of the housing.

19. The disc drive of claim 18, wherein the electronic device is a data storage device.

20. The disc drive of claim 18, wherein the first side is substantially parallel to the second side.