Modular board device, high frequency module, and method of manufacturing the same

• US 20080178463A1
• Filed: 03/19/2008
• Published: 07/31/2008
• Est. Priority Date: 07/03/2002
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Okubora, Akihiko
• Application Number:
  US12/077,434
• Publication Number:
  US 20080178463A1
• Time in Patent Office: Days
• US Class Current: 29/830
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0272 : Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/186 : manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2201/0179 : Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/09072 : Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/09981 : Metallised walls
• CPC Class Codes: H05K 2201/10053 : Switch
• CPC Class Codes: H05K 2203/061 : of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 2203/086 : Using an inert gas
• CPC Class Codes: H05K 2203/1147 : Sealing or impregnating, e.g. of pores
• CPC Class Codes: H05K 2203/1178 : Means for venting or for letting gases escape
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4614 : the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4697 : having cavities, e.g. for mounting components H05K3/4691 takes precedence
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

Claims

1-10. -10. (canceled)

11. A method of manufacturing a module board device, including:

a step of mounting one element body or more onto the principal surface of a first organic substrate in which a conductive pattern or patterns has or have been formed; and

a step of connecting a second organic substrate, in which a recessed portion is formed in correspondence with the area where the element body or bodies is or are mounted at a connecting surface to the first organic substrate in such a manner to seal the element body or bodies into an element body accommodating space portion constituted by the recessed portion so that the element body accommodating space portion is constituted as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained,

a step of forming an insulating resin layer onto the entire surface of at least one second principal surface of the first organic substrate and the second organic substrate of the side opposite to a surface where the first organic substrate and the second organic substrate are connected to each other,

a step of implementing polishing processing to the insulating resin layer to allow the second principal surface to be a planarized (flattened) build-up formation surface, and

a step of forming one build-up wiring layer or more including at least one kind of passive element or more formed by the thin film technology or the thick film technology on the build-up formation surface.

12. The method of manufacturing module board device as set forth in claim 11,

wherein the connecting step of the first organic substrate and second organic substrate is performed within inactive gas atmosphere.

13. The method of manufacturing module board device as set forth in claim 11,

wherein an air vent hole communicating with the element body accommodating space portion is formed at the first organic substrate or the second organic substrate, and subsequently to the connecting step of the first organic substrate and the second organic substrate, a step of deflating air within the element body accommodating space portion through the air vent hole, a step of filling inactive gas into the element body accommodating portion through the air vent hole, and a step of closing the air vent hole are implemented.

14. The method of manufacturing module board device as set forth in claim 11,

wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of sticking adhesive sheet to either one connecting surface of the first organic substrate and the second organic substrate, a step of combining the first organic substrate and the second organic substrate after undergone positioning, and a step of allowing the first organic substrate and the second organic substrate to be in pressure contact with each other.

15. The method of manufacturing module board device as set forth in claim 11,

wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of combining the first organic substrate and the second organic substrate after undergone positioning, and a step of applying ultrasonic wave to a connecting surface of the first organic substrate and the second organic substrate to weld it.

16. The method of manufacturing module board device as set forth in claim 11, including:

a step of forming a shield layer by shield material consisting of silicon oxide, silicon nitride, silicon carbide, boron nitride or Diamond Like Carbon of at least one layer or more which can be formed as film under low temperature condition at an element body mounting area and a recessed portion which constitute at least the element accommodating space portion of the first organic substrate and the second organic substrate,

wherein the element body accommodating space portion is constituted by the shield layer as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained.

17. The method of manufacturing module board device as set forth in claim 11, including

a step of forming a shield layer consisting of metallic film of at least one layer or more at an element body mounting area and a recessed portion which constitute at least the element accommodating space portion of the first organic substrate and the second organic substrate,

wherein the element accommodating space portion is constituted by the shield layer as a space portion in which electromagnetic wave characteristic is maintained along with moisture resistance characteristic and oxidation resistance characteristic.

18-21. -21. (canceled)

22. A method of manufacturing a high frequency module, including;

a step of manufacturing a base substrate portion via a step of mounting an element body or more on the principal surface of a first organic substrate in which a conductive pattern or patterns is or are formed, a step of connecting a second organic substrate, in which a recessed portion is formed in correspondence with the area where the element body or bodies is or are mounted at a connecting surface to the first organic substrate, to the first organic substrate in such a manner to seal the element body or bodies within the element body accommodating space portion so that the element body accommodating space portion is constituted as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained, a step of forming an insulating resin layer onto the entire surface of at least one second principal surface of the first organic substrate and the second organic substrate of the side opposite to a surface where the first organic substrate and the second organic substrate are connected to each other, and a step of implementing polishing processing to the insulating resin layer to allow the second principal surface to be a planarized (flattened) build-up formation surface; and

a step of forming a high frequency circuit portion via a step of forming one build-up wiring layer or more in which a conductive pattern or patterns is or are formed on a dielectric insulating layer formed at the build-up formation surface of the base substrate portion, and at least one kind of passive element or elements is or are formed by the thin film technology or the thick film technology, the build-up wiring layer being via-connected to the conductive pattern or patterns and/or the element body or bodies of the first organic substrate, and a step of mounting high frequency circuit components (parts) onto the build-up wiring layer of the uppermost layer.

23. The method of manufacturing high frequency module as set forth in claim 22,

wherein, at the step of manufacturing the base substrate portion, the connecting step of the first organic substrate and the second organic substrate is performed within inactive gas atmosphere.

24. The method of manufacturing high frequency module as set forth in claim 22,

wherein there is used the first organic substrate or the second organic substrate in which an air vent hole communicating with the element body accommodating space portion is formed, and, at the step of manufacturing the base substrate portion, as steps subsequent to the connecting step of the first organic substrate and the second organic substrate, a step of deflating air within the element body accommodating space portion through the air vent hole, a step of filling inactive gas into the element body accommodating space portion through the air vent hole, and a step of closing the air vent hole are implemented to hermetically introduce or fill inactive gas within the element body accommodating space portion.

25. The method of manufacturing high frequency module as set forth in claim 22,

wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of sticking adhesive sheet to either one connecting surface of the first organic substrate and the second organic substrate, a step of combining the first organic substrate and the second organic substrate after undergone positioning, and a step of allowing the first organic substrate and the second organic substrate to be in pressure contact with each other.

26. The method of manufacturing high frequency module as set forth in claim 22,

wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of combining the first organic substrate and the second organic substrate after positioning, and a step of applying ultrasonic wave to a connecting surface of the first organic substrate and the second organic substrate to weld it.

27. The method of manufacturing high frequency module as set forth in claim 22,

wherein the step of forming the build-up wiring layer is adapted so that a first wiring layer is formed via a step of forming photosensitive dielectric layer onto the entire surface of the build-up formation surface of the base substrate portion, a via formation step and a step of forming a conductive pattern or patterns onto the photosensitive dielectric layer, and wiring layers of upper layers are formed in succession via similar steps onto the first wiring layer, and

a step of forming solder resist layer and an electrode formation step are implemented to the wiring layer of the uppermost layer to mount high frequency circuit components (parts).