Shared RF bus structure
First Claim
Patent Images
1. A device comprises:
- a plurality of integrated circuits (ICs), wherein each of the plurality of ICs includes;
a plurality of circuit modules;
a switching module coupled to the plurality of circuit modules, wherein the switching module;
receives an outbound bus communication from one of the plurality of circuit modules;
determines whether the outbound bus communication is an internal IC communication or an external IC communication;
provides the outbound bus communication to another one of the plurality of circuit modules when the outbound bus communication is an internal IC communication; and
outputs the outbound bus communication when the outbound bus communication is an external IC communication;
a radio frequency (RF) bus transceiver coupled to convert the outbound bus communication into an outbound RF bus signal;
an antenna interface; and
an antenna structure; and
an RF bus structure, wherein the antenna interface provides the outbound RF bus signal to the antenna structure, wherein the antenna structure transmits the outbound RF bus signal via the RF bus structure to another one of the plurality of ICs.
3 Assignments
0 Petitions
Accused Products
Abstract
A device includes a plurality of ICs and an RF bus structure. Each IC includes a plurality of circuit modules, a switching module, an RF bus transceiver, an antenna interface, and an antenna structure. The switching module provides controlled access to the RF bus transceiver, which communicates via the RF bus structure, among the plurality of circuit modules for external IC communications and provides connectivity among the circuit modules for internal IC communications.
-
Citations
24 Claims
-
1. A device comprises:
-
a plurality of integrated circuits (ICs), wherein each of the plurality of ICs includes; a plurality of circuit modules; a switching module coupled to the plurality of circuit modules, wherein the switching module; receives an outbound bus communication from one of the plurality of circuit modules; determines whether the outbound bus communication is an internal IC communication or an external IC communication; provides the outbound bus communication to another one of the plurality of circuit modules when the outbound bus communication is an internal IC communication; and outputs the outbound bus communication when the outbound bus communication is an external IC communication; a radio frequency (RF) bus transceiver coupled to convert the outbound bus communication into an outbound RF bus signal; an antenna interface; and an antenna structure; and an RF bus structure, wherein the antenna interface provides the outbound RF bus signal to the antenna structure, wherein the antenna structure transmits the outbound RF bus signal via the RF bus structure to another one of the plurality of ICs. - View Dependent Claims (2, 3, 4, 5, 6, 12)
-
-
7. A device comprises:
-
a plurality of integrated circuits (ICs), wherein each of the plurality of ICs includes; a plurality of circuit modules, wherein each of the plurality of circuit modules generates an outbound bus signal; a plurality of switching modules coupled to the plurality of circuit modules, wherein a corresponding one of the plurality of switching modules; receives the outbound bus signal from a corresponding one of the plurality of circuit modules; determines whether the outbound bus signal is an internal IC communication or an external IC communication; outputs the outbound bus signal via a first path when the outbound bus communication is an internal IC communication; and outputs the outbound bus signal via a second path when the outbound bus communication is an external IC communication; a plurality of radio frequency (RF) bus transceivers, wherein a RF bus transceiver of the plurality of RF bus transceivers is coupled to receive the outbound bus signal via the first path and to convert the outbound bus signal into an outbound RF bus signal; a plurality of internal RF bus antenna interfaces associated with the plurality of RF bus transceivers; a plurality of internal RF bus antenna structures associated with the plurality of internal RF bus antenna interfaces; an external bus multiplexing module coupled to receive the plurality of outbound bus signals via the second paths, wherein the external bus multiplexing module outputs one of the plurality of outbound bus signals; an external RF bus transceiver coupled to convert the one of the plurality of outbound bus signals into an outbound external RF bus signal; an external RF bus antenna interface; and an external RF bus antenna structure, wherein the external RF bus antenna interface provides the outbound external RF bus signal to the external RF bus antenna structure; and an external RF bus structure, wherein the external RF bus antenna structure transmits the outbound external RF bus signal via the external RF bus structure to another one of the plurality of ICs. - View Dependent Claims (8, 9, 10, 11)
-
-
13. An integrated circuit (IC) comprises:
-
a plurality of circuit modules on a die; a package substrate supporting, the die, wherein the package substrate includes a micro-electromechanical (MEM) area; a radio frequency (RF) bus transceiver module on the die and associated with at least one of the plurality of circuit modules, wherein the RF bus transceiver module includes; a baseband processing module coupled to convert outbound bus data into an outbound bus symbol stream and to convert an inbound bus symbol stream into inbound bus data; a transmitter section coupled to convert the outbound bus symbol stream into an outbound RF bus signal; a receiver section coupled to convert an inbound RF bus signal into an inbound bus symbol stream; a transformer having a differential winding and a single-ended winding, wherein the differential winding is coupled to at least one of the transmitter section and the receiver section; an impedance matching circuit coupled to the single-ended winding; and a transmission line coupled to the impedance matching circuit, wherein at least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area. - View Dependent Claims (14, 15, 16, 17, 18)
-
-
19. An integrated circuit (IC) comprises:
-
a plurality of circuit modules on a die, wherein the die includes a micro-electromechanical (MEM) area; a radio frequency (RF) bus transceiver module on the die and associated with at least one of the plurality of circuit modules, wherein the RF bus transceiver module includes; a baseband processing module coupled to convert outbound bus data into an outbound bus symbol stream and to convert an inbound bus symbol stream into inbound bus data; a transmitter section coupled to convert the outbound bus symbol stream into an outbound RF bus signal; a receiver section coupled to convert an inbound RF bus signal into an inbound bus symbol stream; a transformer having a differential winding and a single-ended winding, wherein the differential winding is coupled to at least one of the transmitter section and the receiver section; an impedance matching circuit coupled to the single-ended winding; and a transmission line coupled to the impedance matching circuit, wherein at least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area. - View Dependent Claims (20, 21, 22, 23, 24)
-
Specification