Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
First Claim
1. A method of packaging semiconductor light emitting device, comprising:
- providing a substrate having the semiconductor light emitting device on a front face thereof and a contact on a front face thereof, wherein the light emitting device is electrically connected to the contact on the front face of the substrate; and
compression molding an optical element on the front face of the substrate over the semiconductor light emitting device and a residual coating over a region of the front face of the substrate including the contact.
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Accused Products
Abstract
Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof and a contact on a front face thereof, wherein the light emitting device is electrically connected to the contact on the front face of the substrate. The substrate is compression molded to form an optical element on the front face of the substrate over the semiconductor light emitting device and a residual coating over a region of the front face of the substrate including the contact. The residual coating over the contact may be removed without damaging the contact. Packaged semiconductor light emitting devices are also provided.
100 Citations
26 Claims
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1. A method of packaging semiconductor light emitting device, comprising:
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providing a substrate having the semiconductor light emitting device on a front face thereof and a contact on a front face thereof, wherein the light emitting device is electrically connected to the contact on the front face of the substrate; and compression molding an optical element on the front face of the substrate over the semiconductor light emitting device and a residual coating over a region of the front face of the substrate including the contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A packaged semiconductor light emitting device, comprising:
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a substrate having a contact on a front face thereof; a semiconductor light emitting device mounted on the front face of the substrate; and a compression molded optical element on the front face of the substrate over the semiconductor light emitting device. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification