STRUCTURE INCLUDING VIA HAVING REFRACTORY METAL COLLAR AT COPPER WIRE AND DIELECTRIC LAYER LINER-LESS INTERFACE AND RELATED METHOD

  • US 20080203570A1
  • Filed: 02/27/2007
  • Published: 08/28/2008
  • Est. Priority Date: 02/27/2007
  • Status: Active Grant
First Claim
Patent Images

1. A structure comprising:

  • a metal wire having a liner-less interface with a dielectric layer and an interlevel dielectric thereabove;

    a via extending upwardly from the metal wire through the dielectric layer and interlevel dielectric; and

    a refractory metal collar extending from a side of the via and partially along the liner-less interface.

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