Electrowetting Pumping Device And Use For Measuring Electrical Activity
First Claim
1. A method for pumping through an orifice (30, 31) of a first substrate (1), a first volume of liquid (2), in contact with a first hydrophobic surface of said substrate, wherein a pressure variation between said first volume of liquid and a second volume of liquid (2′
- ), located in contact with said orifice and a second hydrophobic surface of said substrate, is achieved by electrowetting.
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Accused Products
Abstract
The invention relates to a method for pumping through an orifice (30, 31) of a first substrate (1), a first volume of liquid (2) in contact with a first hydrophobic surface of said substrate, wherein a pressure variation between the first volume of liquid and a second volume of liquid (2′), located in contact with said orifice and a second hydrophobic surface of said substrate, is achieved by electrowetting.
113 Citations
28 Claims
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1. A method for pumping through an orifice (30, 31) of a first substrate (1), a first volume of liquid (2), in contact with a first hydrophobic surface of said substrate, wherein a pressure variation between said first volume of liquid and a second volume of liquid (2′
- ), located in contact with said orifice and a second hydrophobic surface of said substrate, is achieved by electrowetting.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A device for pumping volume of liquid, including:
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a substrate (1), having a first and a second surface, at least one of which is hydrophobic or covered with a hydrophobic layer, and at least one orifice (30, 31) crossing through said substrate, means (4) for displacing, by electrowetting, at least one volume of liquid on one of said faces of the substrate. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification