Intracavity Probe With Continuous Shielding of Acoustic Window

• US 20080228082A1
• Filed: 03/22/2005
• Published: 09/18/2008
• Est. Priority Date: 04/02/2004
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Hart, Jeffrey, Becker, David, Scheirer, Barry, Hornberger, Alan, Wickline, Kevin
• Granted Patent: US 8,353,839 B2
• Time in Patent Office: Days
• US Class Current: 600/459
• CPC Class Codes: G10K 11/02 Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators

Abstract

An ultrasound probe has a transducer array which is moved to scan a patient with ultrasonic energy. The array is located in a fluid chamber (42) which is enclosed by an acoustic window end cap (34). The acoustic window cap is coated with a thin conductive layer (38) which shields the transducer and its motive mechanism from EFI/RFI emissions. The conductive layer is coupled to a reference potential.

Claims

1. An ultrasound probe which is shielded from electronic emissions comprising:

an ultrasonic transducer located in a fluid chamber;

a movable mechanism on which the transducer is mounted for scanning of the transducer;

an acoustic window enclosing the fluid chamber through which ultrasonic energy is transmitted or received; and

a conductive layer lining the acoustic window which is coupled to a reference potential.

2. The ultrasound probe of claim 1, wherein the conductive layer is located on the inner surface of the acoustic window.

3. The ultrasound probe of claim 1, wherein the conductive layer is embedded in the acoustic window.

4. The ultrasound probe of claim 1, wherein the acoustic window comprises a dome-shaped cap.

5. The ultrasound probe of claim 1, wherein the acoustic window comprises a relatively flat contact lens-shaped cap.

6. The ultrasound probe of claim 4, wherein the ultrasonic transducer comprises a curved array transducer which is oscillated to scan a volumetric region.

7. The ultrasound probe of claim 1, wherein the conductive layer is made of gold, a titanium/gold alloy, or aluminum.

8. The ultrasound probe of claim 1, wherein the conductive layer is formed on the acoustic window by vacuum deposition processes such as sputtering, vacuum evaporation, physical vapor deposition, arc vapor deposition, ion plating or laminating.

9. The ultrasound probe of claim 1, wherein the conductive layer is coupled to a reference potential by conductive epoxy, solder connection, clamped pressure creating a metal-to-metal contact, conductive gaskets or O-rings, or discrete drain wires.

10. The ultrasound probe of claim 1, wherein the conductive layer comprises a continuous layer of conductive material.

11. The ultrasound probe of claim 1, wherein the conductive layer comprises a porous layer of conductive material.

12. The ultrasound probe of claim 11, wherein the porous layer comprises a grid-like screen of conductive material.

13. The ultrasound probe of claim 1, wherein the conductive layer is thin enough to be highly transmissive of ultrasound at a frequency of the transducer.

14. The ultrasound probe of claim 13, wherein the conductive layer exhibits a thickness of 1/16 of a wavelength or less of the frequency of the transducer.

15. The ultrasound probe of claim 13, wherein the conductive layer exhibits a thickness in the range of 1000-3000 Angstroms.