HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE

• US 20080246500A1
• Filed: 09/19/2007
• Published: 10/09/2008
• Est. Priority Date: 05/23/2000
• Status: Active Grant

• Current Assignee: Advantest Corporation
• Original Assignee: Verigy Limited (Advantest Corporation)
• Inventors: Mok, Sammy, Swiatowiec, Frank John, Parekh, Nitin, Litza, Anna, Shan, Zhaohui, Kao, Andrew, Modlin, Douglas, McKay, Douglas, CHONG, Fu Chiung
• Granted Patent: US 7,872,482 B2
• Time in Patent Office: Days
• US Class Current: 324/761
• CPC Class Codes: G01R 1/073 Multiple probes
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Claims

1. A process, comprising the steps of:

providing an assembly comprising a substrate having a first surface and a second surface opposite the first surface, a plurality of spring probes on the first surface and extending from the first surface to define a plurality of probe tips, a corresponding plurality of electrical contacts located on the second surface, and electrical connections extending from each of the spring probes to each of the corresponding plurality of electrical contacts;

confining the probe tips in a fixture that is parallel to any of the first surface and the second surface of the substrate, and

applying heat to the assembly, such that the probe tips conform to the fixture.

2. The process of claim 1, further comprising the step of:

applying at least one plating layer to the probe tips any of before and after the heating step.

3. The process of claim 1, further comprising the step of:

applying at least one plating layer to the probe tips before the heating step, wherein at least one of the plating layers comprises any of nickel, palladium cobalt, rhodium, and gold.

4. The process of claim 1, further comprising the step of:

applying at least one plating layer to the probe tips before the heating step, wherein at least one of the plating layers comprises a thickness of 2 microns to 10 microns.

5. The process of claim 1, further comprising the step of:

applying at least one plating layer to the probe tips after the heating step, wherein at least one of the plating layers comprises a thickness of 5 microns to 50 microns.

6. The process of claim 1, wherein the spring probes comprise any of stress metal springs, flexible springs, compliant springs, and elongate resilient probe elements.

7. The process of claim 1, wherein the heating step comprises heating the assembly to between 175 Centigrade and 225 degrees Centigrade.

8. The process of claim 1, wherein the heating step comprises heating the assembly for a time period of between 1 hour and 3 hours.

9. The process of claim 1, wherein the fixture comprises a flat planar surface, and wherein the heating step anneals the spring probes to conform to the flat planar surface.

10. The process of claim 1, further comprising the step of:

cooling the heated assembly to relieve stresses between the substrate and one or more layers of the spring probes.

11. The process of claim 1, wherein the assembly comprises any of a probe chip, a Z-block, and a motherboard.

12. The process of claim 1, wherein the substrate comprises ceramic.

13. An assembly comprising:

a substrate having a first surface and a second surface opposite the first surface;

a plurality of spring probes on the first surface and extending from the first surface to define a plurality of planarized probe tips;

a corresponding plurality of electrical contacts located on the second surface; and

electrical connections extending from each of the spring probes to each of the corresponding plurality of electrical contacts,

wherein the probe tips of the assembly are planarized by a method comprising the steps of

confining the probe tips in a fixture that is parallel to any of the first surface and the second surface of the substrate, and

applying heat to the assembly, wherein the probe tips conform to the fixture.

14. The assembly of claim 13, wherein the probe tips further comprise at least one plating layer that is formed any of before and after the planarization.

15. The assembly of claim 13, wherein the probe tips further comprise at least one plating layer that is formed before the planarization, and wherein at least one of the plating layers comprises any of nickel, palladium cobalt, rhodium, and gold.

16. The assembly of claim 13, wherein the probe tips further comprise at least one plating layer that is formed before the planarization, and wherein at least one of the plating layers comprises a thickness of 2 microns to 10 microns.

17. The assembly of claim 13, wherein the probe tips further comprise at least one plating layer that is formed after the planarization, and wherein at least one of the plating layers comprises a thickness of 5 microns to 50 microns.

18. The assembly of claim 13, wherein the spring probes comprise any of stress metal springs, flexible springs, compliant springs, and elongate resilient probe elements.

19. The assembly of claim 13, wherein the heating step comprises heating the assembly to between 175 Centigrade and 225 degrees Centigrade.

20. The assembly of claim 13, wherein the heating step comprises heating the assembly for a time period of between 1 hour and 3 hours.

21. The assembly of claim 13, wherein the heating step anneals the spring probes to conform to a flat planar surface.

22. The assembly of claim 13, wherein the planarization further comprises the step of:

cooling the heated assembly to relieve stresses between the substrate and one or more layers of the spring probes.

23. The assembly of claim 13, wherein the assembly comprises any of a probe chip, a Z-block, and a motherboard.

24. The assembly of claim 13, wherein the substrate comprises ceramic.

25. A system for planarizing an assembly comprising a substrate having a first surface and a second surface opposite the first surface, a plurality of spring probes on the first surface and extending from the first surface to define a plurality of probe tips, a corresponding plurality of electrical contacts located on the second surface, and electrical connections extending from each of the spring probes to each of the corresponding plurality of electrical contacts, wherein the system comprises:

a first reference surface;

a mechanism for confining the probe tips in relation to the first reference surface that is parallel to any of the first surface and the second surface of the substrate, and

a mechanism for applying heat to the assembly to conform the probe tips to the reference surface.

26. The system of claim 25, wherein the heating mechanism heats the assembly to between 175 Centigrade and 225 degrees Centigrade.

27. The system of claim 25, wherein the heating mechanism heats the assembly to for a time period of between 1 hour and 3 hours.

28. The system of claim 25, wherein the heating mechanism anneals the spring probes to conform to a flat planar surface.

29. The system of claim 25, further comprising:

a mechanism for cooling the heated assembly.

30. The system of claim 29, wherein the cooling mechanism relieves stresses between the substrate and one or more layers of the spring probes.