Electronic Module and Method for Producing Such a Module

• US 20080247142A1
• Filed: 11/09/2006
• Published: 10/09/2008
• Est. Priority Date: 12/28/2005
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Hornung, Stefan, Feiler, Wolfgang, Koester, Thomas, Wolf, Kuno
• Granted Patent: US 8,169,791 B2
• Time in Patent Office: Days
• US Class Current: 361/737
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

Electronic module (10), and an electric motor (12) containing one, and also a production method for one, having an electrically conductive first substrate (16) which has a basic body (54) and which has a second electrically conductive substrate (18) mounted on it, and having at least one power component which is arranged on a first substrate (16), and the second substrate (18) is fitted with further components (40) on a side (32) which is remote from the first substrate (16), where the second substrate (18) has a smaller base area (19) than the basic body (54) of the first substrate (16), and the power components (22) are mounted on the first substrate (16) outside the outer perimeter (70) of the second substrate (18)—next to the latter.

Claims

1. An electronic module (10), in particular for triggering an electric motor (12), having an electrically conductive first substrate (16), which has a base body (54) and on which a second electrically conductive substrate (18) is secured, and having at least one power component, which is located on the first substrate (16), and the second substrate (18) is assembled with further components (40) on a side (32) facing away from the first substrate (16),

characterized in that the second substrate (18) has a smaller base (19) than the base body (54) of the first substrate (16), and the power components (22), outside the outer circumference (70) of the second substrate (18), are secured—

beside the second substrate—

to the first substrate (16).

2. The electronic module (10) as defined by claim 1, characterized in that the power components (22) on the first substrate (16) are soldered or conductively adhesively bonded—

in particular using a joining form.

3. The electronic module (10) as defined by claim 1, characterized in that the power components (22) are electrically conductively connected to the first substrate (16) by means of the die attach method.

4. The electronic module (10) as defined by claim 1, characterized in that the second substrate (18) is adhesively bonded to the first substrate (16) in electrically insulating fashion.

5. The electronic module (10) as defined by claim 1, characterized in that the electrical connections (72) of the power components (22) with one another and/or with the second and/or with the first substrate (16) are embodied as bond wires (74).

6. The electronic module (10) as defined by claim 1, characterized in that the first substrate (16) is embodied as a stamped grid (14) with securing elements (66) integrally formed onto it which are simultaneously usable for the fixation of the stamped grid (14) in the joining form.

7. The electronic module (10) as defined by claim 1, characterized in that the second substrate (18) is embodied as a hybrid ceramic (17), on which, as electronic components (40), a microprocessor (42) and/or a triggering logic element (48) and a position sensor element (44) for an armature shaft (90) of the electric motor (12) are located, and the electronic components (40) are capable of being assembled variably by SMD or flip-chip technology by means of soldering or conductive adhesive technology.

8. The electronic module (10) as defined by claim 1, characterized in that the power components (22) are embodied as bare die elements without a housing—

in particular as power MOSFETs (28).

9. The electronic module (10) as defined by claim 1, characterized in that the power components (22) in peripheral regions (55) of the base body (54) are located approximately symmetrically with respect to the second substrate (18).

10. An electronic module (10), in particular an ignition module of an ignition coil, as defined by claim 1, characterized in that precisely one power component (22) and one shunt for current measurement are soldered or conductively adhesively bonded to the first substrate (16).

11. An electric motor (12) having an electronic module (10) as defined by claim 1, characterized in that the base body (54) of the first substrate (16) and the second substrate (18) together are extrusion-coated on a plastic body (62) in such a way that extensions (56) integrally formed onto the base body (54) protrude from the plastic body (62) in order to form an electrical and/or mechanical interface (58) for attaching further motor components (64).

12. The electric motor (12) as defined by claim 1, characterized in that the first substrate (16), toward the second substrate (18), has a plane surface (38), which extends continuously, at least inside the plastic body (62), in a single horizontal plane (37).

13. A method for producing an electronic module (10), in particular as defined by claim 1, characterized by the following steps:

on a first substrate (16)—

in particular a stamped grid (14)—

having a base body (54) and outer extensions (56) integrally formed onto it, power components (22)—

in particular transistors (26) and/or diodes (24)—

are soldered or conductively adhesively bonded to the outer peripheral region (55) of the base body (54);

a second substrate (18)—

in particular a hybrid ceramic (17)—

with a smaller base (19) than the base body (54) of the first substrate (16) is assembled beforehand with electronic components (40) and adhesively bonded electrically insulatingly to a free region (39) of the first substrate (16);

the composite thus created is hardened by means of an oven process;

after that, electrical bond connections (74) of the power components (22) with one another and/or with the first and/or second substrate (16, 18);

around the base body (54) of the first substrate (16), together with the second substrate (18), a plastic body (62) is integrally injection-molded on in such a way that the extensions (56) protrude freely from the plastic body (62).

14. The method as defined by claim 13, characterized in that for starting the soldering or adhesive bonding of the power components (52) and/or starting the adhesive bonding of the second substrate (18) to the first substrate (16), the latter is placed in a joining device, and in particular by means of fastening means (66)—

preferably bores (68)—

integrally formed onto the first substrate (16)—

are fixed to the joining device.

15. The method as defined by claim 13, characterized in that the power components (22) are electrically conductively connected to the first substrate (16) by means of die attach methods.