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High power LED lighting assembly incorporated with a heat dissipation module with heat pipe

  • US 20080253125A1
  • Filed: 04/11/2007
  • Published: 10/16/2008
  • Est. Priority Date: 04/11/2007
  • Status: Active Grant
First Claim
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1. A LED lighting assembly, comprising:

  • a heat exchange base, comprising at least one LED configuration plane and at least one central hollow part, the LED configuration plane thereof being located on an outer surface of the heat exchange base;

    at least one LED array, comprising a plurality of LEDs, each LED being positioned on the LED configuration plane of the heat exchange base at a predetermined angle for projection;

    at least one heat pipe, comprising a heated section, a cooling section and a conducting section which connects the heated section to the cooling section and containing a working fluid, in which the heated section is inserted into the central hollow part of the heat exchange base and the connecting channel extends from the heat exchange base; and

    a heat dissipation module, being arranged at the cooling section of the heat pipe;

    wherein when a thermal energy generated by the LED is conducted from the heat exchange base to the heated section of the heat pipe, the working fluid in the heat pipe is heated and flows from the conducting section to the cooling section and transmits heat to the heat dissipation module at the cooling section to dissipates the thermal energy.

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