SEMICONDUCTOR DEVICE WITH IMPROVED PADS
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate;
a circuit portion formed on said semiconductor substrate and including a plurality of semiconductor elements;
insulating lamination formed above said semiconductor substrate and covering said circuit portion;
multilevel wiring structure formed in said insulating lamination and including wiring patterns and via conductors; and
pad electrode structure formed above said semiconductor substrate and connected to said multilevel wiring structure, said pad electrode structure including pad wiring patterns in a plurality of levels and pad via conductors interconnecting said pad wiring patterns, at least said pad wiring pattern in an uppermost level including a pad pattern and a sealing pattern surrounding said pad pattern in a loop shape with some distance from said pad pattern, at least one of the pad wiring patterns in a level other than the uppermost level having a continuous extended pad pattern of a size overlapping said sealing pattern, said pad via conductors including a plurality of columnar via conductors disposed in an area overlapping said pad pattern and a loop-shaped wall portion disposed in an area overlapping said sealing pattern, said pad pattern of said pad wiring pattern or said extended pad pattern and said columnar via conductors constituting a laminated bonding pad, and said extended pad pattern, said sealing pattern and said loop-shaped wall portion surrounding said laminated bonding pad to form a cup-shaped moisture resistant structure having a function of shielding moisture and hydrogen.
5 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device has: a circuit portion having semiconductor elements formed on a semiconductor substrate; insulating lamination formed above the semiconductor substrate and covering the circuit portion; a multilevel wiring structure formed in the insulating lamination and including wiring patterns and via conductors; and a pad electrode structure formed above the semiconductor substrate and connected to the multilevel wiring structure. The pad electrode structure includes pad wiring patterns and pad via conductors interconnecting the pad wiring patterns, the uppermost pad wiring pattern includes a pad pattern and a sealing pattern surrounding the pad pattern in a loop shape. Another pad wiring pattern has continuous extended pad pattern of a size overlapping the sealing pattern. The pad via conductors include a plurality of columnar via conductors disposed in register with the pad pattern and a loop-shaped wall portion disposed in register with the sealing pattern.
38 Citations
20 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate; a circuit portion formed on said semiconductor substrate and including a plurality of semiconductor elements; insulating lamination formed above said semiconductor substrate and covering said circuit portion; multilevel wiring structure formed in said insulating lamination and including wiring patterns and via conductors; and pad electrode structure formed above said semiconductor substrate and connected to said multilevel wiring structure, said pad electrode structure including pad wiring patterns in a plurality of levels and pad via conductors interconnecting said pad wiring patterns, at least said pad wiring pattern in an uppermost level including a pad pattern and a sealing pattern surrounding said pad pattern in a loop shape with some distance from said pad pattern, at least one of the pad wiring patterns in a level other than the uppermost level having a continuous extended pad pattern of a size overlapping said sealing pattern, said pad via conductors including a plurality of columnar via conductors disposed in an area overlapping said pad pattern and a loop-shaped wall portion disposed in an area overlapping said sealing pattern, said pad pattern of said pad wiring pattern or said extended pad pattern and said columnar via conductors constituting a laminated bonding pad, and said extended pad pattern, said sealing pattern and said loop-shaped wall portion surrounding said laminated bonding pad to form a cup-shaped moisture resistant structure having a function of shielding moisture and hydrogen. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for manufacturing a semiconductor device, comprising steps of:
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forming a plurality of semiconductor elements in each chip area of a semiconductor substrate, which includes a plurality of chip areas; forming a lower interlevel insulating film on said semiconductor substrate, said lower interlevel insulating film covering said plurality of semiconductor elements; forming a ferroelectric capacitor on said lower interlevel insulating film; forming an insulating lamination on said lower interlevel insulating film, said insulating lamination covering said ferroelectric capacitor; forming a multilevel wiring structure disposed in said insulating lamination; and forming a pad electrode structure disposed above said semiconductor substrate and connected to said multilevel wiring structure, said pad electrode structure containing, in said insulating lamination, a plurality of pad wiring patterns and pad via conductors interconnecting said pad wiring patterns, at least said pad wiring patterns in an uppermost level including a pad pattern and a sealing pattern surrounding said pad pattern in a loop shape with some distance from said pad pattern, at least one pad wiring pattern in a level other than the uppermost level having a continuous extended pad pattern of a size overlapping said sealing pattern, said pad via conductors including a plurality of columnar via conductors disposed in an area overlapping said pad pattern and a loop-shaped wall portion disposed in an area overlapping said sealing pattern, said pad pattern of said pad wiring pattern or said extended pad pattern and said columnar via conductors constituting a laminated bonding pad, and said extended pad pattern, said sealing pattern and said loop-shaped wall portion surrounding said laminated bonding pad to form a cup-shaped moisture resistant structure having a function of shielding moisture and hydrogen.
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Specification