Heat Exchange Enhancement

• US 20080258598A1
• Filed: 06/13/2008
• Published: 10/23/2008
• Est. Priority Date: 03/31/2006
• Status: Abandoned Application

• Current Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd.
• Original Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd.
• Inventors: Shuy, Geoffrey Wen-Tai
• Application Number:
  US12/138,800
• Publication Number:
  US 20080258598A1
• Time in Patent Office: Days
• US Class Current: 313/46
• CPC Class Codes: B60Q 1/20 Fog lights
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 45/48 with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 13/185 Heat-exchange surfaces provided with microstructures or with porous coatings
• CPC Class Codes: F28F 21/04 of ceramic; of concrete; of natural stone
• CPC Class Codes: H01L 23/3731 Ceramic materials or glass H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20427 having radiation enhancing surface treatment, e.g. black coating
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/265 1 mil or less

Abstract

A heat exchange device that includes a structural section and a thin layer of material attached to a surface of the structural section. The thin layer of material has a thickness less than 100 microns. The combination of the structural section and the thin layer of material has a higher thermal transfer coefficient than the structural section alone, the thermal transfer coefficient representing an ability to exchange thermal energy with an ambient gas.

Claims

1-23. -23. (canceled)

24. An apparatus comprising:

an electronic device; and

a heat exchange structure on which the electronic device is attached, the heat exchange structure comprising

a structural section to define a structure of the heat exchange structure, and

a thin layer of material coupled to at least a portion of a surface of the structural section, the thin layer of material having a thickness less than 100 microns;

wherein the combination of the structural section and the thin layer of material has a higher thermal transfer coefficient than the structural section alone, the thermal transfer coefficient representing an ability to exchange thermal energy with an ambient gas.

25. The apparatus of claim 24 wherein the electronic device comprises

a light emitting diode.

26. The apparatus of claim 24 wherein the electronic component is directly attached to the thin layer of material.

45. The apparatus of claim 24 wherein the thin layer of ceramic material comprising spikes each having a diameter less than 1 micron at mid-height.

46. The apparatus of claim 24 wherein the thin layer of ceramic material comprises a first sub-layer and a second sub-layer, the first sub-layer being substantially impermeable to air molecules, the second sub-layer being at least partially permeable to air molecules.

27. An MR-16 lamp comprising:

a heat exchange device comprising;

a structural section; and

a thin layer of ceramic material attached to a surface of the structural section, the thin layer of ceramic material having a thickness less than 100 microns; and

light emitting diodes mounted on the heat exchange device and configured to dissipate heat through the heat exchange device.

28. The MR-16 lamp of claim 27 wherein the thin layer of ceramic material comprising spikes each having a diameter less than 1 micron at mid-height.

29. The MR-16 lamp of claim 27 wherein the thin layer of ceramic material comprises a first sub-layer and a second sub-layer, the first sub-layer being substantially impermeable to air molecules, the second sub-layer being at least partially permeable to air molecules.

30. A wall wash lamp comprising:

a heat exchange device comprising;

a structural section; and

a thin layer of ceramic material attached to a surface of the structural section, the thin layer of ceramic material having a thickness less than 100 microns; and

light emitting diodes mounted on the heat exchange device and configured to dissipate heat through the heat exchange device.

31. The wall wash lamp of claim 30 wherein the thin layer of ceramic material comprising spikes each having a diameter less than 1 micron at mid-height.

32. The wall wash lamp of claim 30 wherein the thin layer of ceramic material comprises a first sub-layer and a second sub-layer, the first sub-layer being substantially impermeable to air molecules, the second sub-layer being at least partially permeable to air molecules.

33. The wall wash lamp of claim 30, further comprising a control circuit for controlling an overall color emitted by the light emitting diodes.

34-44. -44. (canceled)