THIN FILM TRANSISTOR ARRAY SUBSTRATE, METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE
First Claim
1. A thin film transistor array substrate comprising:
- a semiconductor layer formed over a substrate and having source/drain regions;
a gate insulating film covering the semiconductor layer;
a gate electrode arranged in the opposed position to the channel region of the semiconductor layer with the gate insulating film interposed therebetween;
an interlayer insulating film covering the gate electrode;
a wiring electrode connected to the source/drain regions through a contact hole piercing through the interlayer insulating film and the gate insulating film;
a protective film covering the wiring electrode and the interlayer insulating film;
a pixel electrode connected to the wiring electrode through a through hole piercing through the protective film;
a lower capacitor electrode formed with and extending from the semiconductor layer;
a common line electrode formed from the same layer as the gate electrode and arranged in the opposed position to the lower capacitor electrode with the gate insulating film interposed therebetween; and
an upper capacitor electrode arranged in the opposed position to the common line electrode with a dielectric film having film thickness thinner than the interlayer insulating film interposed therebetween.
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Accused Products
Abstract
A thin film transistor array substrate in accordance with the present invention comprising a semiconductor layer formed over the substrate and having source/drain regions, a gate insulating film, a gate electrode, an interlayer insulating film, wiring electrodes connected to the source/drain regions, a protective film, a pixel electrode connected to the wiring electrode, a lower capacitor electrode formed with and extending from the semiconductor layer, a common line electrode formed from the same layer as the gate electrode and arranged in the opposed position to the lower capacitor electrode with the gate insulating film interposed therebetween, and an upper capacitor electrode arranged in the opposed position to the common line electrode with a dielectric film (protective film) having film thickness thinner than the interlayer insulating film interposed therebetween.
56 Citations
15 Claims
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1. A thin film transistor array substrate comprising:
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a semiconductor layer formed over a substrate and having source/drain regions; a gate insulating film covering the semiconductor layer; a gate electrode arranged in the opposed position to the channel region of the semiconductor layer with the gate insulating film interposed therebetween; an interlayer insulating film covering the gate electrode; a wiring electrode connected to the source/drain regions through a contact hole piercing through the interlayer insulating film and the gate insulating film; a protective film covering the wiring electrode and the interlayer insulating film; a pixel electrode connected to the wiring electrode through a through hole piercing through the protective film; a lower capacitor electrode formed with and extending from the semiconductor layer; a common line electrode formed from the same layer as the gate electrode and arranged in the opposed position to the lower capacitor electrode with the gate insulating film interposed therebetween; and an upper capacitor electrode arranged in the opposed position to the common line electrode with a dielectric film having film thickness thinner than the interlayer insulating film interposed therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a thin film transistor array substrate, comprising:
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a step for forming a semiconductor layer having source/drain regions, and a lower capacitor electrode extending from the semiconductor layer over a substrate; a step for forming a gate insulating film covering the semiconductor layer and the lower capacitor electrode; a step for forming a gate electrode arranged in the opposed position to the channel region of the semiconductor layer with the gate insulating film interposed therebetween, and a common line electrode arranged in the opposed position to the lower capacitor electrode with the gate insulating film interposed therebetween; a step for forming an interlayer insulating film covering the gate electrode and the common line electrode; a step for forming a contact hole with the source/drain regions being exposed and an opening with the common line electrode being exposed by etching the interlayer insulating film and the gate insulating film; a step for forming a wiring electrode connected to the source/drain regions through the contact hole; a step for forming a protective film having film thickness thinner than the interlayer insulating film so as to cover the wiring electrode, the interlayer insulating film, and the opening, and to have a through hole with a part of the wiring electrode being exposed; and a step for forming a pixel electrode connected to the wiring electrode through the through hole and arranged in the opposed position to the common line electrode with the protective film interposed therebetween. - View Dependent Claims (9, 10)
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11. A method of manufacturing a thin film transistor array substrate, comprising:
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a step for forming a semiconductor layer having source/drain regions, and a lower capacitor electrode extending from the semiconductor layer over a substrate; a step for forming a gate insulating film covering the semiconductor layer and the lower capacitor electrode; a step for forming a gate electrode arranged in the opposed position to the channel region of the semiconductor layer with the gate insulating interposed therebetween, and a common line electrode arranged in the opposed position to the lower capacitor electrode with the gate insulating film interposed therebetween; a step for forming an interlayer insulating film covering the gate electrode and the common line electrode; a step for forming a contact hole with the source/drain regions being exposed and a thin film portion having thinner film thickness in the interlayer insulating film above the common line electrode by etching the interlayer insulating film and the gate insulating film; a step for forming a wiring electrode connected to the source/drain regions through the contact hole and arranged in the opposed position to the common line electrode with the thin film portion in the interlayer insulating film interposed therebetween; a step for forming a protective film so as to cover the wiring electrode and the interlayer insulating film and to have a through hole with a part of the wiring electrode being exposed; and a step for forming a pixel electrode connected to the wiring electrode through the through hole. - View Dependent Claims (12, 13, 14, 15)
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Specification